• DocumentCode
    3462695
  • Title

    Strained silicon technology

  • Author

    O´Neill, A. ; Olsen, S. ; Escobedo-Cousin, E. ; Varzgar, J. ; Agaiby, R. ; Chattopadhyay, S. ; Dobrosz, P. ; Bull, S.

  • Author_Institution
    Sch. of Electr., Electron. & Comput. Eng., Newcastle Univ.
  • fYear
    2006
  • fDate
    Oct. 2006
  • Firstpage
    104
  • Lastpage
    107
  • Abstract
    Following a brief review of strained silicon technology options, this paper presents results and analysis of strained Si n-channel MOSFETs fabricated on thin SiGe virtual substrates. Significant improvements in electrical performance are demonstrated compared with Si control devices. The impact of SiGe device self-heating is compared for strained Si MOSFETs fabricated on thin and thick virtual substrates. The work demonstrates that by using high quality thin virtual substrates the compromised performance enhancements commonly observed in short gate length MOSFETs and high bias conditions due to self-heating in conventional thick virtual substrate devices are eradicated
  • Keywords
    MOSFET; semiconductor technology; substrates; Si; device self-heating; electrical performance; n-channel MOSFET; strained silicon technology; virtual substrates; CMOS technology; Capacitive sensors; Dielectric losses; Dielectric substrates; Fabrication; Germanium silicon alloys; MOSFETs; Performance gain; Silicon germanium; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-0160-7
  • Electronic_ISBN
    1-4244-0161-5
  • Type

    conf

  • DOI
    10.1109/ICSICT.2006.306089
  • Filename
    4098033