DocumentCode :
3462695
Title :
Strained silicon technology
Author :
O´Neill, A. ; Olsen, S. ; Escobedo-Cousin, E. ; Varzgar, J. ; Agaiby, R. ; Chattopadhyay, S. ; Dobrosz, P. ; Bull, S.
Author_Institution :
Sch. of Electr., Electron. & Comput. Eng., Newcastle Univ.
fYear :
2006
fDate :
Oct. 2006
Firstpage :
104
Lastpage :
107
Abstract :
Following a brief review of strained silicon technology options, this paper presents results and analysis of strained Si n-channel MOSFETs fabricated on thin SiGe virtual substrates. Significant improvements in electrical performance are demonstrated compared with Si control devices. The impact of SiGe device self-heating is compared for strained Si MOSFETs fabricated on thin and thick virtual substrates. The work demonstrates that by using high quality thin virtual substrates the compromised performance enhancements commonly observed in short gate length MOSFETs and high bias conditions due to self-heating in conventional thick virtual substrate devices are eradicated
Keywords :
MOSFET; semiconductor technology; substrates; Si; device self-heating; electrical performance; n-channel MOSFET; strained silicon technology; virtual substrates; CMOS technology; Capacitive sensors; Dielectric losses; Dielectric substrates; Fabrication; Germanium silicon alloys; MOSFETs; Performance gain; Silicon germanium; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0160-7
Electronic_ISBN :
1-4244-0161-5
Type :
conf
DOI :
10.1109/ICSICT.2006.306089
Filename :
4098033
Link To Document :
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