DocumentCode
3462695
Title
Strained silicon technology
Author
O´Neill, A. ; Olsen, S. ; Escobedo-Cousin, E. ; Varzgar, J. ; Agaiby, R. ; Chattopadhyay, S. ; Dobrosz, P. ; Bull, S.
Author_Institution
Sch. of Electr., Electron. & Comput. Eng., Newcastle Univ.
fYear
2006
fDate
Oct. 2006
Firstpage
104
Lastpage
107
Abstract
Following a brief review of strained silicon technology options, this paper presents results and analysis of strained Si n-channel MOSFETs fabricated on thin SiGe virtual substrates. Significant improvements in electrical performance are demonstrated compared with Si control devices. The impact of SiGe device self-heating is compared for strained Si MOSFETs fabricated on thin and thick virtual substrates. The work demonstrates that by using high quality thin virtual substrates the compromised performance enhancements commonly observed in short gate length MOSFETs and high bias conditions due to self-heating in conventional thick virtual substrate devices are eradicated
Keywords
MOSFET; semiconductor technology; substrates; Si; device self-heating; electrical performance; n-channel MOSFET; strained silicon technology; virtual substrates; CMOS technology; Capacitive sensors; Dielectric losses; Dielectric substrates; Fabrication; Germanium silicon alloys; MOSFETs; Performance gain; Silicon germanium; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
Conference_Location
Shanghai
Print_ISBN
1-4244-0160-7
Electronic_ISBN
1-4244-0161-5
Type
conf
DOI
10.1109/ICSICT.2006.306089
Filename
4098033
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