• DocumentCode
    3462863
  • Title

    A general Green function analysis for SAW devices

  • Author

    Peach, R.C.

  • Author_Institution
    COM DEV Ltd., Cambridge, Ont., Canada
  • Volume
    1
  • fYear
    1995
  • fDate
    7-10 Nov 1995
  • Firstpage
    221
  • Abstract
    Methods for calculating Green functions that can fully characterize the properties of a SAW substrate with respect to both mechanical and electrical excitation are described. The Green function is initially represented as a 4×4 matrix of functions in k (wavenumber) space; it describes the three surface displacement components and the electrical potential in terms of the three surface stress components and the surface charge density (line sources are assumed). The x space representation of the Green function is computed by a Fourier transform when required. The software includes facilities for locating and characterizing all singular points. The Green function method has been applied to the analysis of wave propagation in periodic structures including both electrical and mass loading effects; a simple normal mode model is used to describe the mechanical behaviour of the electrodes. Examples of practical analyses are given; data is also given on the convergence of the method with respect to the numbers of sample points
  • Keywords
    Green´s function methods; convergence of numerical methods; matrix algebra; surface acoustic wave devices; ultrasonic propagation; Fourier transform; Green function analysis; SAW devices; SAW substrate properties; convergence; electrical excitation; electrical loading effects; mass loading effects; mechanical excitation; normal mode model; periodic structures; surface charge density; surface displacement components; surface stress components; wave propagation; Electric potential; Fourier transforms; Green function; Mechanical factors; Periodic structures; Space charge; Stress; Surface acoustic wave devices; Surface acoustic waves; Surface waves;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 1995. Proceedings., 1995 IEEE
  • Conference_Location
    Seattle, WA
  • ISSN
    1051-0117
  • Print_ISBN
    0-7803-2940-6
  • Type

    conf

  • DOI
    10.1109/ULTSYM.1995.495572
  • Filename
    495572