• DocumentCode
    346289
  • Title

    Technology and design challenges for low power and high performance [microprocessors]

  • Author

    De, Vivek ; Borkar, Shekhar

  • Author_Institution
    MicroComput., Hillsboro, OR, USA
  • fYear
    1999
  • fDate
    17-17 Aug. 1999
  • Firstpage
    163
  • Lastpage
    168
  • Abstract
    We discuss key barriers to continued scaling of supply voltage and technology for microprocessors to achieve low-power and high-performance. In particular, we focus on short-channel effects, device parameter variations, excessive subthreshold and gate oxide leakage, as the main obstacles dictated by fundamental device physics. Functionality of special circuits in the presence of high leakage, SRAM cell stability, bit line delay scaling, and power consumption in clocks and interconnects, will be the primary design challenges in the future. Soft error rate control and power delivery pose additional challenges. All of these problems are further compounded by the rapidly escalating complexity of microprocessor designs. The excessive leakage problem is particularly severe for battery-operated, high-performance microprocessors.
  • Keywords
    VLSI; integrated circuit design; integrated circuit interconnections; leakage currents; low-power electronics; microprocessor chips; SRAM cell stability; VLSI design; bit line delay scaling; clock consumption; device parameter variations; excessive subthreshold leakage; gate oxide leakage; high-performance operation; interconnection power consumption; low-power design; microprocessors; power delivery; short-channel effects; soft error rate control; supply voltage scaling; technology scaling; threshold voltage scaling; Circuit stability; Clocks; Delay lines; Energy consumption; Integrated circuit interconnections; Microprocessors; Physics; Power system stability; Random access memory; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Low Power Electronics and Design, 1999. Proceedings. 1999 International Symposium on
  • Conference_Location
    San Diego, CA, USA
  • Print_ISBN
    1-58113-133-X
  • Type

    conf

  • Filename
    799433