DocumentCode :
3462983
Title :
Enhanced boiling heat transfer with copper oxide hierarchical surfaces
Author :
Chu, K.-H. ; Zhu, Yujia ; Miljkovic, N. ; Nam, Y. ; Enright, Ryan ; Wang, E.N.
Author_Institution :
Massachusetts Inst. of Technol., Cambridge, MA, USA
fYear :
2013
fDate :
16-20 June 2013
Firstpage :
2272
Lastpage :
2275
Abstract :
We experimentally investigated the enhancement in critical heat flux (CHF) during pool boiling on copper oxide (CuO) hierarchical surfaces, where surface roughness at multiple length scales is presented. On the surface with the highest surface roughness factor of 13.3, a CHF of ≈250 W/cm2 and heat transfer coefficient of ≈8×104 W/m2 K, were achieved. A good agreement between our developed model and experimental results supports the idea that roughness-amplified surface forces are responsible for CHF enhancement on structured surfaces. The work promises enhanced heat removal capability using hierarchically-structured surfaces for high heat flux thermal management.
Keywords :
copper compounds; heat transfer; surface roughness; thermal management (packaging); CuO; copper oxide hierarchical surfaces; critical heat flux enhancement; heat flux thermal management; heat removal capability; heat transfer coefficient; pool boiling; roughness-amplified surface forces; surface roughness factor; Copper; Heat transfer; Heating; Rough surfaces; Silicon; Surface roughness; Surface treatment; boiling; copper oxide; critical heat flux; hierarchical surface; nanostructure; surface roughness;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on
Conference_Location :
Barcelona
Type :
conf
DOI :
10.1109/Transducers.2013.6627258
Filename :
6627258
Link To Document :
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