DocumentCode
3463260
Title
Effect of implanting silicon in buried oxide on the radiation hardness of the partially-depleted CMOS/SOI
Author
Wei, He ; Zheng-xuan, Zhang ; En-xia, Zhang ; Cong, Qian ; Hao, Tian ; Xi, Wang
Author_Institution
Shanghai Inst. of Microsyst. & Inf. Technol., Chinese Acad. of Sci., Shanghai
fYear
2006
fDate
23-26 Oct. 2006
Firstpage
215
Lastpage
217
Abstract
In order to improve the total dose radiation hardness of the buried oxides (BOX) of separation by implanted oxygen (SIMOX) silicon on insulator (SOI),we implanted silicon into the BOX at a dose of l times 1015cm-2 and then annealed at 800 degC in N2 ambience. Partially depleted CMOS/SOI inverters with enclosed-gate structure fabricated on improved SIMOX substrate and standard SIMOX substrate were exposed to 60CO gamma-ray radiation. The results of demonstrate that compare to standard CMOS/SOI inverters; the improved CMOS/SOI inverters have less switching voltage shifts and smaller leakage current after the same total dose irradiation
Keywords
CMOS integrated circuits; SIMOX; gamma-ray effects; radiation hardening (electronics); semiconductor doping; 800 C; SIMOX substrate; buried oxide; gamma-ray radiation; implanting silicon; partially depleted CMOS-SOI inverters; radiation hardness; separation by implanted oxygen; silicon on insulator; Annealing; CMOS technology; Helium; Information technology; Inverters; Leakage current; MOS devices; Radiation hardening; Silicon on insulator technology; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
Conference_Location
Shanghai
Print_ISBN
1-4244-0160-7
Electronic_ISBN
1-4244-0161-5
Type
conf
DOI
10.1109/ICSICT.2006.306165
Filename
4098065
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