Title :
Elastocaloric heat pumping using a shape memory alloy foil device
Author :
Ossmer, H. ; Miyazaki, S. ; Kohl, M.
Author_Institution :
Karlsruhe Inst. of Technol., Karlsruhe, Germany
Abstract :
This paper explores, develops and demonstrates a miniature heat pump based on the elastocaloric effect in shape memory alloys (SMAs). The active material is a Ti50.5Ni49.1Fe0.4 foil of 30 μm thickness showing a maximum temperature change during pseudoelastic loading/unloading up to +20/-16 K. This effect is implemented in a heat pump design consisting of SMA bridge, heat source and sink. First-of-its-kind demonstrators reveal a temperature difference between source and sink of about 7 K after 100 s for a ratio of heat capacities of SMA bridge and heat source of 1:85. The coefficient of performance (COP) of the device for cooling is 2.8 whereas the theoretical COP of the material is 10.5.
Keywords :
design engineering; heat pumps; heat sinks; shape memory effects; temperature; titanium alloys; COP; SMA bridge; Ti50.5Ni49.1Fe0.4; coefficient-of-performance; elastocaloric effect; elastocaloric heat pump; heat pump design; heat sink; heat source; miniature heat pump; pseudoelastic loading; pseudoelastic unloading; shape memory alloy foil device; temperature change; temperature difference; Bridges; Heat pumps; Heat sinks; Heat transfer; Heating; Strain; Shape memory alloy; TiNi; elastocaloric effect; heat pumping; superelasticity;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on
Conference_Location :
Anchorage, AK
DOI :
10.1109/TRANSDUCERS.2015.7181026
