DocumentCode :
3463964
Title :
A Sub-1W to 2W Low-Power IA Processor for Mobile Internet Devices and Ultra-Mobile PCs in 45nm Hi-Κ Metal Gate CMOS
Author :
Gerosa, Gianfranco ; Curtis, Steve ; Addeo, Mike D. ; Jiang, Bo ; Kuttanna, Belliappa ; Merchant, Feroze ; Patel, Binta ; Taufique, Mohammed ; Samarchi, Haytham
Author_Institution :
Intel, Austin, TX
fYear :
2008
fDate :
3-7 Feb. 2008
Firstpage :
256
Lastpage :
611
Abstract :
This paper describes a low-power Intel* Architecture (IA) processor specifically designed for Mobile Internet Devices (MID) and Ultra- Mobile PCs (UMPC) where average power consumed is in the order of a few hundred mW (as measured by MobileMark´05 OP @ 60 nits brightness) with performance similar to mainstream Ultra-Mobile PCs. The design consists of an in-order pipeline capable of issuing 2 instructions per cycle supporting 2 threads, 32KB instruction and 24KB data LI caches, independent integer and floating point execution units, x86 front end execution unit, a 512KB L2 cache and a 533 MT/s dual-mode (GTL and CMOS) front-side-bus (FSB). The design contains 47 M transistors in a die size under 25 mm2 manufactured in a 9-metal 45nm CMOS process with optimized transistors for low leakage packaged in a Halide-Free 441 ball, 14x13 mm2 muFCBGA. Thermal Design Power (TDP) consumption is measured at 2 W using a synthetic power-virus test at a frequency of 2 GHz.
Keywords :
CMOS integrated circuits; Internet; low-power electronics; microprocessor chips; mobile radio; Hi-K metal gate CMOS; Intel architecture processor; low-power IA processor; mobile Internet device; synthetic power-virus test; thermal design power consumption; ultra-mobile PC; Brightness; CMOS process; Design optimization; Internet; Manufacturing processes; Personal communication networks; Pipelines; Power measurement; Process design; Yarn;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference, 2008. ISSCC 2008. Digest of Technical Papers. IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4244-2010-0
Electronic_ISBN :
978-1-4244-2011-7
Type :
conf
DOI :
10.1109/ISSCC.2008.4523154
Filename :
4523154
Link To Document :
بازگشت