• DocumentCode
    3463964
  • Title

    A Sub-1W to 2W Low-Power IA Processor for Mobile Internet Devices and Ultra-Mobile PCs in 45nm Hi-Κ Metal Gate CMOS

  • Author

    Gerosa, Gianfranco ; Curtis, Steve ; Addeo, Mike D. ; Jiang, Bo ; Kuttanna, Belliappa ; Merchant, Feroze ; Patel, Binta ; Taufique, Mohammed ; Samarchi, Haytham

  • Author_Institution
    Intel, Austin, TX
  • fYear
    2008
  • fDate
    3-7 Feb. 2008
  • Firstpage
    256
  • Lastpage
    611
  • Abstract
    This paper describes a low-power Intel* Architecture (IA) processor specifically designed for Mobile Internet Devices (MID) and Ultra- Mobile PCs (UMPC) where average power consumed is in the order of a few hundred mW (as measured by MobileMark´05 OP @ 60 nits brightness) with performance similar to mainstream Ultra-Mobile PCs. The design consists of an in-order pipeline capable of issuing 2 instructions per cycle supporting 2 threads, 32KB instruction and 24KB data LI caches, independent integer and floating point execution units, x86 front end execution unit, a 512KB L2 cache and a 533 MT/s dual-mode (GTL and CMOS) front-side-bus (FSB). The design contains 47 M transistors in a die size under 25 mm2 manufactured in a 9-metal 45nm CMOS process with optimized transistors for low leakage packaged in a Halide-Free 441 ball, 14x13 mm2 muFCBGA. Thermal Design Power (TDP) consumption is measured at 2 W using a synthetic power-virus test at a frequency of 2 GHz.
  • Keywords
    CMOS integrated circuits; Internet; low-power electronics; microprocessor chips; mobile radio; Hi-K metal gate CMOS; Intel architecture processor; low-power IA processor; mobile Internet device; synthetic power-virus test; thermal design power consumption; ultra-mobile PC; Brightness; CMOS process; Design optimization; Internet; Manufacturing processes; Personal communication networks; Pipelines; Power measurement; Process design; Yarn;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 2008. ISSCC 2008. Digest of Technical Papers. IEEE International
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    978-1-4244-2010-0
  • Electronic_ISBN
    978-1-4244-2011-7
  • Type

    conf

  • DOI
    10.1109/ISSCC.2008.4523154
  • Filename
    4523154