Title :
Interaction effects of temperature and stress on matched-mode gyroscope frequencies
Author :
Tatar, E. ; Guo, Chuangxin ; Mukherjee, Tridib ; Fedder, Gary K.
Author_Institution :
Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Abstract :
We present our initial results toward understanding the interaction of temperature and stress on resonant frequencies of a matched-mode SOI-MEMS gyroscope. We also validate a new electrostatic frequency tuning design for gyroscopes that works over large displacements. A stress and temperature gradient is formed on the gyroscope die by using on-chip silicon heaters, affecting the gyroscope frequencies. Simulation and measurements of the gyroscope frequencies under different gradient conditions are compared. We also show that the orientation of the die with respect to an asymmetric package plays an important role in frequency response of the gyroscope to environmental conditions.
Keywords :
electrostatic devices; frequency response; gyroscopes; micromechanical resonators; microsensors; mode matching; semiconductor device packaging; silicon; silicon-on-insulator; Si; asymmetric package; electrostatic frequency tuning design; environmental condition; frequency response; gyroscope die; gyroscope frequency measurement; matched mode SOI-MEMS gyroscope; matched mode gyroscope frequency; on-chip silicon heater; resonant frequency; stress gradient; stress interaction effect; temperature gradient; temperature interaction effect; Gyroscopes; Heating; Resonant frequency; Stress; Temperature measurement; Temperature sensors; Tuning; Young´s Modulus; frequency tuning; gyroscope; matched-mode; shaped combs; stress and temperature effects;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on
Conference_Location :
Barcelona
DOI :
10.1109/Transducers.2013.6627320