• DocumentCode
    3464150
  • Title

    Fast pulsed heating and impact cooling of thermal microactuators

  • Author

    Pandey, S.S. ; Banerjee, A. ; Hasan, N. ; Banerjee, N. ; Mastrangelo, C.H.

  • Author_Institution
    Electr. & Comput. Eng. Dept., Univ. of Utah, Salt Lake City, UT, USA
  • fYear
    2015
  • fDate
    21-25 June 2015
  • Firstpage
    908
  • Lastpage
    911
  • Abstract
    This paper reports techniques to rapidly heat and cool thermal actuators in microseconds. Rapid temperature changes can lead to high-speed motion and many-fold improvement in load power delivery compared to that achievable with conventional thermal microactuator devices. Rapid heating is achieved by capacitor discharge across the heated element. Rapid cooling is achieved by impacting thin cold plungers that remove heat from hot actuator beams by ultrafast diffusion. We have fabricated and preliminary tested polysilicon thermal actuators based on these principles.
  • Keywords
    cooling; elemental semiconductors; heating; microactuators; silicon; thermal diffusion; thermal management (packaging); Si; capacitor discharge; cool thermal actuators; fast pulsed heating; heat thermal actuators; high-speed motion; hot actuator beams; impact cooling; load power delivery; polysilicon thermal actuators; rapid cooling; rapid heating; thermal microactuator devices; thermal microactuators; thin cold plungers; ultrafast diffusion; Heat sinks; Heat transfer; Heating; Microactuators; Resistance; Microelectromechanical systems; Microfabrication Microactuators;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on
  • Conference_Location
    Anchorage, AK
  • Type

    conf

  • DOI
    10.1109/TRANSDUCERS.2015.7181071
  • Filename
    7181071