DocumentCode
3464150
Title
Fast pulsed heating and impact cooling of thermal microactuators
Author
Pandey, S.S. ; Banerjee, A. ; Hasan, N. ; Banerjee, N. ; Mastrangelo, C.H.
Author_Institution
Electr. & Comput. Eng. Dept., Univ. of Utah, Salt Lake City, UT, USA
fYear
2015
fDate
21-25 June 2015
Firstpage
908
Lastpage
911
Abstract
This paper reports techniques to rapidly heat and cool thermal actuators in microseconds. Rapid temperature changes can lead to high-speed motion and many-fold improvement in load power delivery compared to that achievable with conventional thermal microactuator devices. Rapid heating is achieved by capacitor discharge across the heated element. Rapid cooling is achieved by impacting thin cold plungers that remove heat from hot actuator beams by ultrafast diffusion. We have fabricated and preliminary tested polysilicon thermal actuators based on these principles.
Keywords
cooling; elemental semiconductors; heating; microactuators; silicon; thermal diffusion; thermal management (packaging); Si; capacitor discharge; cool thermal actuators; fast pulsed heating; heat thermal actuators; high-speed motion; hot actuator beams; impact cooling; load power delivery; polysilicon thermal actuators; rapid cooling; rapid heating; thermal microactuator devices; thermal microactuators; thin cold plungers; ultrafast diffusion; Heat sinks; Heat transfer; Heating; Microactuators; Resistance; Microelectromechanical systems; Microfabrication Microactuators;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on
Conference_Location
Anchorage, AK
Type
conf
DOI
10.1109/TRANSDUCERS.2015.7181071
Filename
7181071
Link To Document