DocumentCode :
3464150
Title :
Fast pulsed heating and impact cooling of thermal microactuators
Author :
Pandey, S.S. ; Banerjee, A. ; Hasan, N. ; Banerjee, N. ; Mastrangelo, C.H.
Author_Institution :
Electr. & Comput. Eng. Dept., Univ. of Utah, Salt Lake City, UT, USA
fYear :
2015
fDate :
21-25 June 2015
Firstpage :
908
Lastpage :
911
Abstract :
This paper reports techniques to rapidly heat and cool thermal actuators in microseconds. Rapid temperature changes can lead to high-speed motion and many-fold improvement in load power delivery compared to that achievable with conventional thermal microactuator devices. Rapid heating is achieved by capacitor discharge across the heated element. Rapid cooling is achieved by impacting thin cold plungers that remove heat from hot actuator beams by ultrafast diffusion. We have fabricated and preliminary tested polysilicon thermal actuators based on these principles.
Keywords :
cooling; elemental semiconductors; heating; microactuators; silicon; thermal diffusion; thermal management (packaging); Si; capacitor discharge; cool thermal actuators; fast pulsed heating; heat thermal actuators; high-speed motion; hot actuator beams; impact cooling; load power delivery; polysilicon thermal actuators; rapid cooling; rapid heating; thermal microactuator devices; thermal microactuators; thin cold plungers; ultrafast diffusion; Heat sinks; Heat transfer; Heating; Microactuators; Resistance; Microelectromechanical systems; Microfabrication Microactuators;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on
Conference_Location :
Anchorage, AK
Type :
conf
DOI :
10.1109/TRANSDUCERS.2015.7181071
Filename :
7181071
Link To Document :
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