• DocumentCode
    3464324
  • Title

    Next Generation Smart Power Technologies - Challenges and Innovations Enabling Complex SoC Integration

  • Author

    Tack, Marnix ; Moens, Peter ; Gillon, Renaud ; Janssens, Johan ; Van Roeyen, Stefan ; Sevenhans, Jan

  • Author_Institution
    AMIS, Oudenaarde
  • fYear
    2008
  • fDate
    3-7 Feb. 2008
  • Firstpage
    296
  • Lastpage
    614
  • Abstract
    This paper highlights the key figure-of-merits of SPTs and ongoing technology innovations, such as vertical DMOS switches, Deep Trench Isolation, Power Metal, and SOA-simulation. Examples are given of automotive and telecom applications that benefit from these advanced SPTs. As such these developments will enable truly Smart Power SoC applications.
  • Keywords
    power integrated circuits; SoC integration; smart power technologies; Automotive engineering; Capacitance; Circuits; Electrostatic discharge; Isolation technology; Semiconductor optical amplifiers; Switches; Technological innovation; Vehicle dynamics; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 2008. ISSCC 2008. Digest of Technical Papers. IEEE International
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    978-1-4244-2010-0
  • Electronic_ISBN
    978-1-4244-2011-7
  • Type

    conf

  • DOI
    10.1109/ISSCC.2008.4523174
  • Filename
    4523174
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3464324