Title :
Ultra-Thin Chips on Foil for Flexible Electronics
Author :
Rempp, Horst ; Burghartz, Joachim ; Harendt, Christine ; Pricopi, Nicoleta ; Pritschow, Marcus ; Reuter, Christian ; Richter, Harald ; Schindler, Inge ; Zimmermann, Martin
Author_Institution :
Inst. for Microelectron., Stuttgart
Abstract :
Plastic electronics, thin-film-transistors on foil and ultra-thin chips on foil are technologies currently pursued to support the strongly emerging market for flexible electronics. Ultra-thin CMOS chips on foil will not only provide solutions whenever high circuit performance and/or complexity are required but also in a heterogeneous integration with organic or TFT electronic components on foil, such as for flexible displays. Thinning of conventional CMOS chips in post-processing tends to be unreliable and costly due to difficulties in the control of the grinding process applied to fully processed CMOS wafers or the need of employing expensive silicon-on-insulator (SOI) and handle substrates.
Keywords :
CMOS integrated circuits; flexible electronics; conventional CMOS chips; flexible electronics; fully processed CMOS wafers; grinding process; plastic electronics; silicon-on-insulator; thin-film-transistors; ultra-thin CMOS chips; CMOS process; CMOS technology; Circuit optimization; Consumer electronics; Displays; Electronic components; Flexible electronics; Plastics; Silicon on insulator technology; Thin film transistors;
Conference_Titel :
Solid-State Circuits Conference, 2008. ISSCC 2008. Digest of Technical Papers. IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4244-2010-0
Electronic_ISBN :
978-1-4244-2011-7
DOI :
10.1109/ISSCC.2008.4523193
