DocumentCode :
3464740
Title :
Correlation between yield and waiting time: a quantitative study
Author :
Srinivasan, Krishna ; Sandell, Raka ; Brown, Steven
Author_Institution :
Motorola Inc., USA
fYear :
1995
fDate :
2-4 Oct 1995
Firstpage :
65
Lastpage :
69
Abstract :
Using SEMATECH yield modeling techniques, the effect of reductions in cycle time and of improvements in environmental cleanliness is projected to die-per-wafer yield gains in semiconductor wafer fabrication. This study provides a methodology to determine the impact upon the total process yield of the factory as a result of shortening queue times. Modeling a fabrication facility that uses a 0.25 micron high-performance logic (1poly, 4metal) process flow, the methodology is used to determine variations in yield at different concentrations of airborne particles. In turn, the methodology provides guidelines for implementing operational strategies intended to achieve increases in total process yield
Keywords :
environmental factors; integrated circuit yield; production control; queueing theory; semiconductor process modelling; 0.25 mum; SEMATECH yield modeling techniques; airborne particle concentration; cycle time reduction; die-per-wafer yield gains; environmental cleanliness; fabrication facility model; high-performance logic process flow; operational strategies; queue times; semiconductor wafer fabrication; total process yield; waiting time; Contamination; Fabrication; Guidelines; Job shop scheduling; Logic; Manufacturing processes; Production facilities; Semiconductor device manufacture; Semiconductor device modeling; Strontium;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-2996-1
Type :
conf
DOI :
10.1109/IEMT.1995.526094
Filename :
526094
Link To Document :
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