Title :
A mode-matching 130-kHz ring-coupled gyroscope with 225 ppm initial driving/sensing mode frequency splitting
Author :
Jye Ren ; Chun-You Liu ; Ming-Huang Li ; Cheng-Chi Chen ; Chao-Yu Chen ; Cheng-Syun Li ; Sheng-Shian Li
Author_Institution :
Inst. of NanoEngineering & Microsyst., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Abstract :
A degenerate mode 130-kHz ring-coupled gyroscope with auxiliary transducer array is designed to enhance the sensitivity as well as the mode-matching feature. The proof-of-concept device with 3 μm transducer´s gap is fabricated using a conventional (100) silicon-on-insulator (SOI) wafer process with only two lithography steps. The auxiliary parallel-plate transducer array is located at the maximum displacement of the vibrating ring to enhance the electromechanical coupling while reducing the sensing noise. The in-plane trefoil mode (n=3) is adopted to alleviate the initial frequency splitting in (100) crystalline silicon device layer. The average frequency split for the drive/sense modes over multiple tested devices is only 225 ppm with the mean resonance frequency of 130 kHz. The measured Q-factor is 50 in atmospheric pressure and up to 10,000 in vacuum. Owing to the larger transduction area benefitting from the transducer array design, a low dc-bias voltage (VP) of 3 V in vacuum (21 V in air) is sufficient to sustain the driving loop oscillation. As integrated with the sensing circuits to operate the proposed gyroscope, a scale factor of 2.2 mV/°/s and resolution of 0.26 °/s, respectively, are characterized in atmospheric pressure.
Keywords :
Q-factor measurement; elemental semiconductors; frequency measurement; gyroscopes; lithography; sensor arrays; silicon; silicon-on-insulator; transducers; vibration measurement; Q-factor measurement; SOI wafer process; Si; atmospheric pressure; auxiliary parallel-plate transducer array; average frequency split measurement; crystalline silicon device layer; distance 3 mum; electromechanical coupling; frequency 130 kHz; in-plane trefoil mode; initial driving-sensing mode frequency splitting; lithography; mode-matching ring-coupled gyroscope; silicon-on-insulator wafer process; voltage 21 V; voltage 3 V; Fabrication; Gyroscopes; Micromechanical devices; Resonant frequency; Sensors; Silicon; Transducers; Gyroscope; MEMS; mode-matching; ring-coupled; transducer array;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on
Conference_Location :
Anchorage, AK
DOI :
10.1109/TRANSDUCERS.2015.7181108