DocumentCode :
3465880
Title :
A 90nm CMOS Dual-Channel Powerline Communication AFE for Homeplug AV with a Gb Extension
Author :
Findlater, Keith ; Bailey, Toby ; Bofill, Adria ; Calder, Neil ; Danesh, Seyed ; Henderson, Robert ; Holland, William ; Hurwitz, Jed ; Maughan, Steve ; Sutherland, Alasdair ; Watt, Ewan
Author_Institution :
Gigle Semicond., Edinburgh
fYear :
2008
fDate :
3-7 Feb. 2008
Firstpage :
464
Lastpage :
628
Abstract :
Powerline communications is currently emerging as a strong candidate for in-home multi-media content distribution. Recently, products have become available that support 200Mb/s rates over the existing electrical wiring, which is high enough to allow streaming of multiple high-definition content. HomePlugAV is one such 200Mb/s powerline modem standard. However, for these devices to fully realize the market potential, the total application cost must be reduced and performance enhancements enabling increased network throughput must be made. Currently, HomePlug-AV products require 4 chips to implement the modem function: a processor, an external memory, an AFE, and an external line driver. With this in mind, this work describes an integrated sub-micron CMOS AFE meeting the HomePlug-AV standard, but with additional Gb/s capability. The gigabit AFE was developed for use over phoneline, coax, and powerline. In this paper we focus on its application for powerline communications.
Keywords :
CMOS integrated circuits; carrier transmission on power lines; home automation; modems; multimedia communication; CMOS dual-channel powerline communication; HomePlug AV; electrical wiring; in-home multimedia content distribution; integrated sub-micron CMOS AFE; powerline modem standard; Bandwidth; Circuit testing; Coupling circuits; Driver circuits; Electronics packaging; Frequency; Integrated circuit measurements; Linearity; Semiconductor device measurement; Throughput;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference, 2008. ISSCC 2008. Digest of Technical Papers. IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4244-2010-0
Electronic_ISBN :
978-1-4244-2011-7
Type :
conf
DOI :
10.1109/ISSCC.2008.4523258
Filename :
4523258
Link To Document :
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