DocumentCode
346592
Title
Dealing with uncertainty in power loss estimates in thermal design of power electronic circuits
Author
Sridhar, Shri ; Eggink, H.J.
Author_Institution
Philips Res., Briarcliff Manor, NY, USA
Volume
2
fYear
1999
fDate
1999
Firstpage
1418
Abstract
Thermal analysis is critical in the conceptual design phase of miniaturized power electronic circuits. Concurrent thermal and packaging design along with electrical design can ensure shortened time-to-market. However, uncertainties in estimates of component loss distribution in the early design phase hamper analysis of whether a proposed design will meet thermal specifications. In this paper, a methodology based on design of experiments (DOE) is proposed to deal with such uncertainties. By combining this methodology with a thermal analysis tool, uncertainties in individual component loss estimates can be translated to predicted temperatures with a minimum number of computational runs. The designer can also use the sensitivity coefficients generated as a result of such analysis to judge the effect of efficiency improvement in individual components on the overall temperature field. An example of the thermal design of a power electronics circuit is provided, where this method has been used to study various design trade-offs and to significantly reduce the design cycle
Keywords
design of experiments; losses; network synthesis; power electronics; thermal analysis; thermal management (packaging); component loss distribution; conceptual design phase; concurrent thermal design; design cycle reduction; design of experiments; electrical design; individual component loss estimates; miniaturized power electronic circuits; packaging design; power electronic circuits; power loss estimates uncertainty; sensitivity coefficients; shortened time-to-market; thermal analysis; thermal analysis tool; thermal design; Circuits; Electronic packaging thermal management; Power system modeling; Surface resistance; Temperature; Thermal conductivity; Thermal factors; Thermal management of electronics; Thermal resistance; Uncertainty;
fLanguage
English
Publisher
ieee
Conference_Titel
Industry Applications Conference, 1999. Thirty-Fourth IAS Annual Meeting. Conference Record of the 1999 IEEE
Conference_Location
Phoenix, AZ
ISSN
0197-2618
Print_ISBN
0-7803-5589-X
Type
conf
DOI
10.1109/IAS.1999.801686
Filename
801686
Link To Document