• DocumentCode
    346592
  • Title

    Dealing with uncertainty in power loss estimates in thermal design of power electronic circuits

  • Author

    Sridhar, Shri ; Eggink, H.J.

  • Author_Institution
    Philips Res., Briarcliff Manor, NY, USA
  • Volume
    2
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    1418
  • Abstract
    Thermal analysis is critical in the conceptual design phase of miniaturized power electronic circuits. Concurrent thermal and packaging design along with electrical design can ensure shortened time-to-market. However, uncertainties in estimates of component loss distribution in the early design phase hamper analysis of whether a proposed design will meet thermal specifications. In this paper, a methodology based on design of experiments (DOE) is proposed to deal with such uncertainties. By combining this methodology with a thermal analysis tool, uncertainties in individual component loss estimates can be translated to predicted temperatures with a minimum number of computational runs. The designer can also use the sensitivity coefficients generated as a result of such analysis to judge the effect of efficiency improvement in individual components on the overall temperature field. An example of the thermal design of a power electronics circuit is provided, where this method has been used to study various design trade-offs and to significantly reduce the design cycle
  • Keywords
    design of experiments; losses; network synthesis; power electronics; thermal analysis; thermal management (packaging); component loss distribution; conceptual design phase; concurrent thermal design; design cycle reduction; design of experiments; electrical design; individual component loss estimates; miniaturized power electronic circuits; packaging design; power electronic circuits; power loss estimates uncertainty; sensitivity coefficients; shortened time-to-market; thermal analysis; thermal analysis tool; thermal design; Circuits; Electronic packaging thermal management; Power system modeling; Surface resistance; Temperature; Thermal conductivity; Thermal factors; Thermal management of electronics; Thermal resistance; Uncertainty;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industry Applications Conference, 1999. Thirty-Fourth IAS Annual Meeting. Conference Record of the 1999 IEEE
  • Conference_Location
    Phoenix, AZ
  • ISSN
    0197-2618
  • Print_ISBN
    0-7803-5589-X
  • Type

    conf

  • DOI
    10.1109/IAS.1999.801686
  • Filename
    801686