Title :
Electrical and mechanical studies of MCM-D interconnect structure
Author :
Chao, Fang-Lin ; Wu, Ruey-Beei ; Pecht, Michael
Author_Institution :
Da-Yeh Inst. of Technol., Taiwan, China
Abstract :
The electrical and mechanical properties of a multilayer thin-film MCM-D interconnect are studied in this investigation. Numerical analyses are executed to calculate the electrical parameters of thin-film microstrip line and it shows that the additional delay decreases while increasing the thickness of the conductor. Environmental scanning electron microscopy (E-SEM) was utilized to characterize mechanical induced defects in signal line. Cracking on metal lines and delamination of polyimide/metal interfaces due to mismatch of coefficient of thermal expansion and the moisture absorption of the polyimide film were observed
Keywords :
integrated circuit interconnections; integrated circuit packaging; microstrip lines; multichip modules; scanning electron microscopy; thermal expansion; E-SEM; MCM-D interconnect structure; cracking; delamination; electrical parameters; electrical properties; environmental scanning electron microscopy; mechanical induced defects; mechanical properties; microstrip line; moisture absorption; multilayer thin-film interconnect; polyimide/metal interfaces; signal line; thermal expansion; Added delay; Conductive films; Delamination; Mechanical factors; Microstrip; Nonhomogeneous media; Numerical analysis; Polyimides; Scanning electron microscopy; Transistors;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-2996-1
DOI :
10.1109/IEMT.1995.526100