Evaluation of thermal-aware design techniques for microprocessors

Author

Richardson, Thomas D. ; Xie, Yuan

Author_Institution

Comput. Sci. & Eng. Dept., Pennsylvania State Univ.

Volume

1

fYear

2005

fDate

24-0 Oct. 2005

Firstpage

215

Lastpage

218

Abstract

As technology scales, temperature in modern high-performance VLSI circuits has increased dramatically. Temperature affects not only the performance but also the power, reliability, and cost of the system. In this paper, we examine two approaches to reduce the on-chip temperature: one is to reduce the power densities of hot functional units by allocating more die area (growing units), and the other one is to use three different migrating computation (MC) techniques to migrate activities among duplicated functional units. Through the use of tools for architectural power and temperature estimation, the effectiveness of these two methods are evaluated for the Alpha 21264 microprocessor

Keywords

integrated circuit design; integrated circuit reliability; microprocessor chips; thermal analysis; Alpha 21264 microprocessor; duplicated functional units; high-performance VLSI circuits; hot functional units; migrating computation techniques; on-chip temperature; temperature estimation; thermal-aware design techniques; Costs; Electronic packaging thermal management; Energy consumption; Knowledge management; Microarchitecture; Microprocessors; Modems; Power system reliability; Temperature; Thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

ASIC, 2005. ASICON 2005. 6th International Conference On

Conference_Location

Shanghai

Print_ISBN

0-7803-9210-8

Type

conf

DOI

10.1109/ICASIC.2005.1611250

Filename

1611250