Title :
Evaluation of thermal-aware design techniques for microprocessors
Author :
Richardson, Thomas D. ; Xie, Yuan
Author_Institution :
Comput. Sci. & Eng. Dept., Pennsylvania State Univ.
Abstract :
As technology scales, temperature in modern high-performance VLSI circuits has increased dramatically. Temperature affects not only the performance but also the power, reliability, and cost of the system. In this paper, we examine two approaches to reduce the on-chip temperature: one is to reduce the power densities of hot functional units by allocating more die area (growing units), and the other one is to use three different migrating computation (MC) techniques to migrate activities among duplicated functional units. Through the use of tools for architectural power and temperature estimation, the effectiveness of these two methods are evaluated for the Alpha 21264 microprocessor
Keywords :
integrated circuit design; integrated circuit reliability; microprocessor chips; thermal analysis; Alpha 21264 microprocessor; duplicated functional units; high-performance VLSI circuits; hot functional units; migrating computation techniques; on-chip temperature; temperature estimation; thermal-aware design techniques; Costs; Electronic packaging thermal management; Energy consumption; Knowledge management; Microarchitecture; Microprocessors; Modems; Power system reliability; Temperature; Thermal management;
Conference_Titel :
ASIC, 2005. ASICON 2005. 6th International Conference On
Conference_Location :
Shanghai
Print_ISBN :
0-7803-9210-8
DOI :
10.1109/ICASIC.2005.1611250
