Title :
Micromechanical measurement subsystem
Author :
Zagursky, V. ; Zibinch, Dz
Abstract :
The subsystem relates to control, testing and measurement instrumentation with closed digital control loop structure and may be used, in particular, for testing and measurement of smooth displacements resulting from, for example, force or temperature deformation of an object, or for detection of changes in geometric dimensions of an object while monitoring its air tightness, in particular, when monitoring air tightness of integrated microcircuits in cremate packages or water tightness of integrated circuits in a watertight case. Also it may be used with some additions for tactile sensing in robotic systems
Keywords :
closed loop systems; digital control; displacement measurement; microsensors; tactile sensors; air tightness monitoring; closed digital control loop structure; elastic membranes; geometric dimensions; linearity; measurement instrumentation; microcontact measurements; micromechanical measurement subsystem; micromechanical transducers; robotic systems; sensitivity; smooth displacements measurements; tactile sensing; water tightness; Circuit testing; Displacement control; Displacement measurement; Force control; Force measurement; Integrated circuit testing; Micromechanical devices; Monitoring; Particle measurements; Temperature control;
Conference_Titel :
AUTOTESTCON Proceedings, 2001. IEEE Systems Readiness Technology Conference
Conference_Location :
Valley Forge, PA
Print_ISBN :
0-7803-7094-5
DOI :
10.1109/AUTEST.2001.948971
