• DocumentCode
    3466742
  • Title

    A Split-Load Interpolation-Amplifier-Array 300MS/s 8b Subranging ADC in 90nm CMOS

  • Author

    Shimizu, Yasuhide ; Murayama, Shigemitsu ; Kudoh, Kohhei ; Yatsuda, Hiroaki

  • Author_Institution
    Sony LSI Design, Nagasaki
  • fYear
    2008
  • fDate
    3-7 Feb. 2008
  • Firstpage
    552
  • Lastpage
    635
  • Abstract
    The ADC is fabricated in 90 nm digital CMOS process. The chip consumes 34 mW at 300MS/s (fin=fs/2) from 1.2 V analog/digital and 2.5 V T/H-switches supply. At 100 MS/s (fin= fs/2), it consumes 6.7 mW from 0.75 V analog/digital and 1.5 V T/H-switches supplies. FOMs are 780 fJ/conversion-step at 300 MS/s (fin=fs/2), 680fJ/conversion-step at 300MS/s (fin=2MHz), 350 fJ/conversion- step at 100 MS/s (fin=fs/2) and 290 fJ/conversion-step at 100 MS/s (fin=2MHz).The active area is 0.29 mm2.
  • Keywords
    CMOS integrated circuits; amplifiers; analogue-digital conversion; ADC; CMOS; power 34 mW; power 6.7 mW; size 90 nm; split-load interpolation-amplifier-array; voltage 0.75 V; voltage 1.2 V; voltage 1.5 V; voltage 2.5 V; word length 8 bit; CMOS process; Capacitance; Capacitors; Clocks; Energy consumption; Interpolation; Quantization; Sampling methods; Timing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 2008. ISSCC 2008. Digest of Technical Papers. IEEE International
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    978-1-4244-2010-0
  • Electronic_ISBN
    978-1-4244-2011-7
  • Type

    conf

  • DOI
    10.1109/ISSCC.2008.4523302
  • Filename
    4523302