DocumentCode :
34670
Title :
On-Wafer Terahertz Ribbon Waveguides Using Polymer–Ceramic Nanocomposites
Author :
Xianbo Yang ; Chahal, Premjeet Prem
Author_Institution :
Dept. of Electr. & Comput. EngineeringTerahertz Syst. Lab., Michigan State Univ., East Lansing, MI, USA
Volume :
5
Issue :
2
fYear :
2015
fDate :
Feb. 2015
Firstpage :
245
Lastpage :
255
Abstract :
This paper investigates the design and fabrication of thin dielectric ribbon waveguides for terahertz (THz) circuit applications. Simulations indicate that dielectric thin ribbon waveguides provide low loss THz wave propagation when a combination of high dielectric constant (high-k ) core and low dielectric constant (low-k ) cladding are used. This combination provides stronger field confinement which helps in reducing losses at waveguide bends and allows higher density integration. Two different fabrication approaches are investigated: 1) photopatterning of spin coated nanocomposite thin films and 2) laser cutting of dry nanocomposite thin films. Characterization of nanocomposites-based waveguides is carried out over a wide frequency range in the THz spectral region. Measurements of a variety of different waveguide samples validate the simulated results and prove that low cost, wafer-level planar THz integrated circuits can be realized with polymer ceramic nanocomposite thin ribbon waveguides.
Keywords :
ceramics; high-k dielectric thin films; integrated circuits; laser beam cutting; low-k dielectric thin films; nanocomposites; permittivity; polymers; rib waveguides; spin coating; wave propagation; THz circuit applications; density integration; dielectric thin ribbon waveguides; dry nanocomposite thin films; fabrication approaches; field confinement; high dielectric constant core; high-k core; laser cutting; low dielectric constant cladding; low loss THz wave propagation; low-k cladding; on-wafer terahertz ribbon waveguides; photopatterning; polymer-ceramic nanocomposites; spin coated nanocomposite thin films; wafer-level planar integrated circuits; Dielectric constant; Dielectric losses; High K dielectric materials; Integrated circuit modeling; Planar waveguides; Propagation losses; High density integration; interconnects; passives; passives.;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2015.2390611
Filename :
7018964
Link To Document :
بازگشت