• DocumentCode
    3467754
  • Title

    A New Approach to Interconversion of Thermal and Electrical Energy

  • Author

    Mischenko, A.S. ; Zhang, Q. ; Scott, J.F. ; Whatmore, R.W. ; Mathur, N.D.

  • Author_Institution
    Dept. of Mater. Sci., Cambridge Univ.
  • fYear
    2006
  • fDate
    23-26 Oct. 2006
  • Firstpage
    1002
  • Lastpage
    1003
  • Abstract
    New approaches to thermal management of electronic components are of general interest. Our work demonstrates a novel solution for this applications area. Highly effective thermal management solutions can potentially help the semiconductor manufacturers to reduce costs and meet some milestones of the silicon roadmap. For example, enormous amount of Joule heating and inability of the state-of-the art coolers to cope with it forces manufacturers to switch to dual-core architectures of processors. Also, our work might inspire a number of blue skies research projects in this particular field because it points to a relatively new approach broadens the scope of applications for ferroelectrics. We have observed large cooling (electrocaloric) effects in thin films under the application of a small electrical voltage. This effect could also be used in reverse to turn low grade waste heat into electricity (pyroelectric energy conversion). In other words, we suggest a way to interconvert thermal end electrical energy
  • Keywords
    direct energy conversion; thermal management (packaging); Joule heating; dual-core architectures; electrical energy; electrocaloric effects; electronic components; ferroelectrics; large cooling effects; low grade waste heat; pyroelectric energy conversion; thermal energy; thermal management; thin films; Art; Costs; Electronic components; Energy conversion; Heating; Semiconductor device manufacture; Silicon; Switches; Thermal management; Thermal management of electronics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-0160-7
  • Electronic_ISBN
    1-4244-0161-5
  • Type

    conf

  • DOI
    10.1109/ICSICT.2006.306642
  • Filename
    4098303