Title :
Electrical conduction and reliability of anisotropic conductive adhesives filled with Ag/Cu-coated epoxy composite particles
Author :
Zhihong, Lei ; Ying, He ; Licong, Gao
Author_Institution :
Dept. of Polymer Mater., Shanghai Univ.
Abstract :
Electrical conductivity and shear strength of epoxy resin filled with Ag/Cu-coated composite particles were studied in this paper. Taking these two factors into account, the optimum concentration of filler was determined to be 12 vol. %. This paper explained that electrical properties of ACFs with different film thickness by experiment. Aging test showed that ACF filled with Ag/Cu-coated composite particles had good thermal stability
Keywords :
conductive adhesives; copper; electrical conductivity; polymers; silver; thermal stability; Ag/Cu-coated; anisotropic conductive adhesives; conductive particle; contact resistance; electrical conductivity; electrical reliability; epoxy composite particles; shear strength; thermal stability; Anisotropic magnetoresistance; Conductive adhesives; Conductivity; Contact resistance; Electrodes; Electronic packaging thermal management; Epoxy resins; Polymers; Silver; Thermal stability;
Conference_Titel :
Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0160-7
Electronic_ISBN :
1-4244-0161-5
DOI :
10.1109/ICSICT.2006.306653
