Copper Nanowires Embedded in Flexible Substrate

The purpose of this study is to fabricate copper nanowires embedded in parylene/polyimide and measure the electrical resistivity. The patterns of copper nanowires were defined by electron beam lithography on amorphous-silicon. Then copper nanowires formed by replacement method in mixture solution of cupric sulfate (CuSO₄ middot 5H₄ O) with HF. After the fabrication of copper, the electrical characteristic by conductive AFM was measured. The use nanoimprint-hot-embossing method was successfully to transfer these copper nanowires onto parylene/polyimide substrate