DocumentCode
3468253
Title
Automated inspection of solder joints-a neural network approach
Author
Sankaran, Vijay ; Chartrand, Brent ; Lillard, D.L.H. ; Embrechts, Mark J. ; Kraft, Russell P.
Author_Institution
Center for Integrated Electron., Rensselaer Polytech. Inst., Troy, NY, USA
fYear
1995
fDate
2-4 Oct 1995
Firstpage
232
Lastpage
237
Abstract
This paper describes a PC-based system for automated inspection of solder joints using neural networks. It presents extensive application of neural networks to solder joint quality data in the form of visual images. Numerous methods for data compression and feature extraction have been applied to enhance the performance of the neural networks. Up to 92 per cent accuracy in identifying solder joint defects was achieved using visual images. This discussion deals with visible light images only but all techniques may be extended equally to X-ray laminographic images as preliminary results from such applications indicate
Keywords
automatic optical inspection; electronic engineering computing; neural nets; soldering; PC-based system; X-ray laminographic images; automated inspection; data compression; defects; feature extraction; neural network; solder joints; visible light images; Assembly; Computer vision; Costs; Data compression; Feature extraction; Inspection; Manufacturing; Neural networks; Process control; Soldering; Surface-mount technology; X-ray imaging; X-ray lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International
Conference_Location
Austin, TX
Print_ISBN
0-7803-2996-1
Type
conf
DOI
10.1109/IEMT.1995.526120
Filename
526120
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