• DocumentCode
    3468253
  • Title

    Automated inspection of solder joints-a neural network approach

  • Author

    Sankaran, Vijay ; Chartrand, Brent ; Lillard, D.L.H. ; Embrechts, Mark J. ; Kraft, Russell P.

  • Author_Institution
    Center for Integrated Electron., Rensselaer Polytech. Inst., Troy, NY, USA
  • fYear
    1995
  • fDate
    2-4 Oct 1995
  • Firstpage
    232
  • Lastpage
    237
  • Abstract
    This paper describes a PC-based system for automated inspection of solder joints using neural networks. It presents extensive application of neural networks to solder joint quality data in the form of visual images. Numerous methods for data compression and feature extraction have been applied to enhance the performance of the neural networks. Up to 92 per cent accuracy in identifying solder joint defects was achieved using visual images. This discussion deals with visible light images only but all techniques may be extended equally to X-ray laminographic images as preliminary results from such applications indicate
  • Keywords
    automatic optical inspection; electronic engineering computing; neural nets; soldering; PC-based system; X-ray laminographic images; automated inspection; data compression; defects; feature extraction; neural network; solder joints; visible light images; Assembly; Computer vision; Costs; Data compression; Feature extraction; Inspection; Manufacturing; Neural networks; Process control; Soldering; Surface-mount technology; X-ray imaging; X-ray lasers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International
  • Conference_Location
    Austin, TX
  • Print_ISBN
    0-7803-2996-1
  • Type

    conf

  • DOI
    10.1109/IEMT.1995.526120
  • Filename
    526120