Title :
Automated inspection of solder joints-a neural network approach
Author :
Sankaran, Vijay ; Chartrand, Brent ; Lillard, D.L.H. ; Embrechts, Mark J. ; Kraft, Russell P.
Author_Institution :
Center for Integrated Electron., Rensselaer Polytech. Inst., Troy, NY, USA
Abstract :
This paper describes a PC-based system for automated inspection of solder joints using neural networks. It presents extensive application of neural networks to solder joint quality data in the form of visual images. Numerous methods for data compression and feature extraction have been applied to enhance the performance of the neural networks. Up to 92 per cent accuracy in identifying solder joint defects was achieved using visual images. This discussion deals with visible light images only but all techniques may be extended equally to X-ray laminographic images as preliminary results from such applications indicate
Keywords :
automatic optical inspection; electronic engineering computing; neural nets; soldering; PC-based system; X-ray laminographic images; automated inspection; data compression; defects; feature extraction; neural network; solder joints; visible light images; Assembly; Computer vision; Costs; Data compression; Feature extraction; Inspection; Manufacturing; Neural networks; Process control; Soldering; Surface-mount technology; X-ray imaging; X-ray lasers;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-2996-1
DOI :
10.1109/IEMT.1995.526120