DocumentCode
3468734
Title
Empirical performance models for 3T1D memories
Author
Lovin, Kristen ; Lee, Benjamin C. ; Liang, Xiaoyao ; Brooks, David ; Wei, Gu-Yeon
fYear
2009
fDate
4-7 Oct. 2009
Firstpage
398
Lastpage
403
Abstract
Process variation poses a threat to the performance and reliability of the 6T SRAM cell. Research has turned to new memory cell designs, such as the 3T1D DRAM cell, as potential replacement designs. If designers are to consider 3T1D memory architectures, performance models are needed to better understand memory cell behavior. We propose a decoupled approach for collecting Monte Carlo HSPICE data, reducing simulation times by simulating memory array components separately based on their contribution to the worst-case critical path. We use this Monte Carlo data to train regression models, which accurately predict retention and access times of a 3T1D memory array with a median error of 7.39%.
Keywords
DRAM chips; Monte Carlo methods; SPICE; SRAM chips; circuit simulation; integrated circuit design; memory architecture; regression analysis; 3T1D DRAM cell; 3T1D memory architectures; 3T1D memory array; 6T SRAM cell; Monte Carlo HSPICE data; empirical performance models; memory array components; memory cell behavior; memory cell designs; potential replacement designs; process variation; regression models; worst-case critical path; Analytical models; Circuit simulation; Computational modeling; Frequency; Integrated circuit reliability; Integrated circuit technology; Memory architecture; Monte Carlo methods; Predictive models; Random access memory;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Design, 2009. ICCD 2009. IEEE International Conference on
Conference_Location
Lake Tahoe, CA
ISSN
1063-6404
Print_ISBN
978-1-4244-5029-9
Electronic_ISBN
1063-6404
Type
conf
DOI
10.1109/ICCD.2009.5413124
Filename
5413124
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