Title :
An on-chip monitoring structure for electromigration failure
Author :
Hao Bai ; Yi-Qi Zhuang ; Xiao-ming Li ; Yu-Bing Lv
Author_Institution :
Dept. of Microelectron., Xidian Univ., Xi´an
Abstract :
This paper discloses an electromigration (EM) monitoring circuit structure for an on-chip end-of-life indicator, which can be integrated and degraded with the device, and give an alarm when the device needs replacing. This is done prior to actual device failure and estimate down time of the system where this IC is used, and it only needs a very small area
Keywords :
electromigration; failure analysis; indicators; integrated circuit reliability; electromigration failure; integrated circuit failure; on-chip end-of-life indicator; on-chip monitoring structure; Acceleration; Circuit testing; Condition monitoring; Current density; Electromigration; Latches; Stress; Switches; Temperature; Voltage;
Conference_Titel :
Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0160-7
Electronic_ISBN :
1-4244-0161-5
DOI :
10.1109/ICSICT.2006.306071
