Title :
A new intelligent power module with Reverse conducting IGBTs for up to 2.5kW motor drives
Author :
Song, Junho ; Lee, Junbae ; Chung, Daewoong ; Suh, Bumseok ; Wolfgang, Frank
Abstract :
This paper presents a new CIPOS™ (Control Integrated Power System) in DIL (Dual-in-line) package, which combines with the features of Infineon trench field stop RC (Reverse conducting) IGBT and a newly optimized Infineon SOI (Silicon On Insulator) gate driver to achieve the excellent solution for up to 2.5kW motor drives. It also comes along with flexible internal schematics, which are tailor made for the target applications by using the combination of PCB and lead-frame construction. This paper provides an overall description of the new CIPOSTM module as well as performance, power ratings, adopted RC-IGBT and SOI gate driver.
Keywords :
electronics packaging; motor drives; power semiconductor devices; control integrated power system; dual-in-line package; intelligent power module; motor drives; reverse conducting IGBT; Circuits; Electronics packaging; Insulated gate bipolar transistors; Inverters; Motor drives; Multichip modules; Power electronics; Silicon on insulator technology; Thermistors; Variable structure systems;
Conference_Titel :
Power Electronics Conference (IPEC), 2010 International
Conference_Location :
Sapporo
Print_ISBN :
978-1-4244-5394-8
DOI :
10.1109/IPEC.2010.5543847