DocumentCode
3469592
Title
Study of the SEU Effect Mechanism on SOI PMOS by 2-D Simulation
Author
Zhao, Fa-Zhan ; Guo, Tian-Lei ; Hai, Chao-He ; Liu, Meng-xin
Author_Institution
Inst. of Microelectron., Chinese Acad. of Sci., Beijing
fYear
2006
fDate
23-26 Oct. 2006
Firstpage
1346
Lastpage
1348
Abstract
2D device simulation with an ideal condition is used to study the mechanism for single-event upset (SEU) of SOI pMOS, which can be more significant in SRAM when gate length is scaling down. The mechanism can be associated with displacement current. Displacement currents across the box layer can be induced as charge is generated in the SOI substrate by an ion strike. It perturbs the electric fields in the substrate near the oxide/substrate interface, thus an abnormal current is observed in drain. The displacement current is related to the box layer thickness, the substrate doping species and concentration, also the drain area. Therefore all this parameter is critical in the design of SOI SRAM ICs
Keywords
MOS memory circuits; SRAM chips; integrated circuit design; radiation hardening (electronics); silicon-on-insulator; 2D device simulation; SEU effect mechanism; SOI substrate; SRAM; ion strike; on SOI PMOS; oxide-substrate interface; single-event upset; Chaos; Doping; Microelectronics; Random access memory; Semiconductor films; Semiconductor process modeling; Silicon; Single event upset; Substrates; Temperature dependence;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
Conference_Location
Shanghai
Print_ISBN
1-4244-0160-7
Electronic_ISBN
1-4244-0161-5
Type
conf
DOI
10.1109/ICSICT.2006.306156
Filename
4098404
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