• DocumentCode
    3469592
  • Title

    Study of the SEU Effect Mechanism on SOI PMOS by 2-D Simulation

  • Author

    Zhao, Fa-Zhan ; Guo, Tian-Lei ; Hai, Chao-He ; Liu, Meng-xin

  • Author_Institution
    Inst. of Microelectron., Chinese Acad. of Sci., Beijing
  • fYear
    2006
  • fDate
    23-26 Oct. 2006
  • Firstpage
    1346
  • Lastpage
    1348
  • Abstract
    2D device simulation with an ideal condition is used to study the mechanism for single-event upset (SEU) of SOI pMOS, which can be more significant in SRAM when gate length is scaling down. The mechanism can be associated with displacement current. Displacement currents across the box layer can be induced as charge is generated in the SOI substrate by an ion strike. It perturbs the electric fields in the substrate near the oxide/substrate interface, thus an abnormal current is observed in drain. The displacement current is related to the box layer thickness, the substrate doping species and concentration, also the drain area. Therefore all this parameter is critical in the design of SOI SRAM ICs
  • Keywords
    MOS memory circuits; SRAM chips; integrated circuit design; radiation hardening (electronics); silicon-on-insulator; 2D device simulation; SEU effect mechanism; SOI substrate; SRAM; ion strike; on SOI PMOS; oxide-substrate interface; single-event upset; Chaos; Doping; Microelectronics; Random access memory; Semiconductor films; Semiconductor process modeling; Silicon; Single event upset; Substrates; Temperature dependence;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-0160-7
  • Electronic_ISBN
    1-4244-0161-5
  • Type

    conf

  • DOI
    10.1109/ICSICT.2006.306156
  • Filename
    4098404