DocumentCode
3469610
Title
Enabling resonant clock distribution with scaled on-chip magnetic inductors
Author
Sinha, Saurabh ; Xu, Wei ; Velamala, Jyothi B. ; Dastagir, Tawab ; Bakkaloglu, Bertan ; Yu, Hongbin ; Cao, Yu
Author_Institution
Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
fYear
2009
fDate
4-7 Oct. 2009
Firstpage
103
Lastpage
108
Abstract
Resonant clock distribution with distributed LC oscillators is promising to reducing clock power and jitter noise. Yet the difficulty in the integration of on-chip inductors still limits its application in practice. This paper resolves such a key issue with sub-50 ¿m magnetic inductors, which are fully compatible with the CMOS process. These inductors leverage soft magnetic coils to achieve inductances up to 4nH, Q-factor of 3 at 1 GHz with a device diameter of only 30-50 ¿m, resulting in area savings of nearly 100X as compared to conventional design. The latency and noise performance of the resonant clock network is demonstrated to be comparable to those using conventional inductors without soft magnetic materials. In addition, inductors with integrated magnetic materials significantly reduce mutual coupling and eddy current loss in the power grid below the clock network. These design advantages enable high density of on-chip distributed oscillators, providing better phase averaging, lower power and superior noise characteristics as compared to traditional buffer-tree based clock network.
Keywords
CMOS integrated circuits; clock distribution networks; eddy current losses; inductors; jitter; magnetic devices; oscillators; CMOS process; LC oscillators; Q-factor; clock power; eddy current loss; frequency 1 GHz; integrated magnetic materials; jitter noise; magnetic inductors; on-chip distributed oscillators; resonant clock distribution; scaled on-chip magnetic inductors; CMOS process; Clocks; Inductors; Jitter; Magnetic devices; Magnetic noise; Magnetic resonance; Noise reduction; Oscillators; Soft magnetic materials;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Design, 2009. ICCD 2009. IEEE International Conference on
Conference_Location
Lake Tahoe, CA
ISSN
1063-6404
Print_ISBN
978-1-4244-5029-9
Electronic_ISBN
1063-6404
Type
conf
DOI
10.1109/ICCD.2009.5413169
Filename
5413169
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