DocumentCode
3469655
Title
An ESD Protection Device Simulation-Design Methodology based on MEDICI
Author
Li, Bin ; Li, Ruoyu ; Luo, Hongwei
Author_Institution
Dept. of Microelectron., South China Univ. of Technol., Guangzhou
fYear
2006
fDate
23-26 Oct. 2006
Firstpage
1358
Lastpage
1360
Abstract
In this paper, MEDICI was used to simulate ESD device by coupling the electrothermal effects. The effects of size parameters on the ESD robustness are discussed. The response time of ESD protection circuit is also analyzed. Tape-outs under different processes exhibited satisfactory ESD robustness, with higher than 4000V in CSMC 0.6 mum process and 3500V in HHNEC 0.25 mum process. It is testified that this methodology is effective
Keywords
electrostatic discharge; integrated circuit design; interference suppression; 0.25 micron; 0.6 micron; CSMC process; ESD protection device; ESD robustness; HHNEC process; MEDICI; electrothermal effects coupling; Circuit analysis; Circuit simulation; Circuit testing; Coupling circuits; Delay; Electrostatic discharge; Electrothermal effects; Medical simulation; Protection; Robustness;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
Conference_Location
Shanghai
Print_ISBN
1-4244-0160-7
Electronic_ISBN
1-4244-0161-5
Type
conf
DOI
10.1109/ICSICT.2006.306160
Filename
4098408
Link To Document