DocumentCode
3469662
Title
Study of water contamination for Thermal process system (TPS)
Author
Matsuo, Takuya ; Sugawara, Yoko ; Fuse, Takashi ; Saito, Masato
Author_Institution
Tech. Dev. Center, Tokyo Electron Ltd., Nirasaki, Japan
fYear
2013
fDate
6-6 Sept. 2013
Firstpage
1
Lastpage
2
Abstract
We examined water desorption process of various resin materials. The water desorption from the surface depended on their dielectric permittivity and low permittivity made high desorption rate. Comprehension of the water desorption phenomena is important to make an atmospheric dew point fall down quickly. We can suggest that using low dielectric permittivity resins is effect on shorten the time exchange the wafers.
Keywords
absorption; chemical engineering; contamination; desorption; resins; TPS tools; atmospheric dew point; desorption; load lock chamber; organic compounds; process chamber; resin; semiconductor fabrication tool; thermal process system; water absorption; water contamination; Joints; Permittivity; Phase measurement; Transmitters; contamination; dew point; resin; water;
fLanguage
English
Publisher
ieee
Conference_Titel
e-Manufacturing & Design Collaboration Symposium (eMDC), 2013
Conference_Location
Hsinchu
Type
conf
DOI
10.1109/eMDC.2013.6756040
Filename
6756040
Link To Document