Title :
Study of water contamination for Thermal process system (TPS)
Author :
Matsuo, Takuya ; Sugawara, Yoko ; Fuse, Takashi ; Saito, Masato
Author_Institution :
Tech. Dev. Center, Tokyo Electron Ltd., Nirasaki, Japan
Abstract :
We examined water desorption process of various resin materials. The water desorption from the surface depended on their dielectric permittivity and low permittivity made high desorption rate. Comprehension of the water desorption phenomena is important to make an atmospheric dew point fall down quickly. We can suggest that using low dielectric permittivity resins is effect on shorten the time exchange the wafers.
Keywords :
absorption; chemical engineering; contamination; desorption; resins; TPS tools; atmospheric dew point; desorption; load lock chamber; organic compounds; process chamber; resin; semiconductor fabrication tool; thermal process system; water absorption; water contamination; Joints; Permittivity; Phase measurement; Transmitters; contamination; dew point; resin; water;
Conference_Titel :
e-Manufacturing & Design Collaboration Symposium (eMDC), 2013
Conference_Location :
Hsinchu
DOI :
10.1109/eMDC.2013.6756040
