Title :
Fine pitch thermosonic wire bonding
Author_Institution :
Final Manuf. Oper., Motorola Microprocessor & Memory Technol. Group, Austin, TX, USA
Abstract :
Characterization in a manufacturing environment, under normal operating conditions using standardized material, provides further information on machine performance, capillary suitability, and potential problems to be anticipated and prepared for during manufacturing implementation. The current work has focused on establishing process capability for bonding both 85 μm (3.4 mil) and 73 μm (2.9 mil) minimum pad dimensions on 107 μm (4.2 mil) and 92 μm (3.6 mil) centers, respectively. Two state-of-the-art fully automatic thermosonic gold wire bonders, from two different equipment manufacturers, were used
Keywords :
fine-pitch technology; integrated circuit packaging; lead bonding; 107 micron; 73 micron; 85 micron; 92 micron; capillary suitability; equipment manufacture; fine pitch technology; manufacturing environment; manufacturing implementation; minimum pad dimensions; process capability; thermosonic wire bonding; Bonding; Circuits; Coatings; Filtering; Gold; Manufacturing; Manufacturing automation; Microprocessors; Optical filters; Polyimides; Production facilities; Wafer bonding; Wire;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-2996-1
DOI :
10.1109/IEMT.1995.526178
