Fine pitch thermosonic wire bonding

Author

Cavasin, Daniel

Author_Institution

Final Manuf. Oper., Motorola Microprocessor & Memory Technol. Group, Austin, TX, USA

fYear

1995

fDate

2-4 Oct 1995

Firstpage

299

Lastpage

303

Abstract

Characterization in a manufacturing environment, under normal operating conditions using standardized material, provides further information on machine performance, capillary suitability, and potential problems to be anticipated and prepared for during manufacturing implementation. The current work has focused on establishing process capability for bonding both 85 μm (3.4 mil) and 73 μm (2.9 mil) minimum pad dimensions on 107 μm (4.2 mil) and 92 μm (3.6 mil) centers, respectively. Two state-of-the-art fully automatic thermosonic gold wire bonders, from two different equipment manufacturers, were used

Keywords

fine-pitch technology; integrated circuit packaging; lead bonding; 107 micron; 73 micron; 85 micron; 92 micron; capillary suitability; equipment manufacture; fine pitch technology; manufacturing environment; manufacturing implementation; minimum pad dimensions; process capability; thermosonic wire bonding; Bonding; Circuits; Coatings; Filtering; Gold; Manufacturing; Manufacturing automation; Microprocessors; Optical filters; Polyimides; Production facilities; Wafer bonding; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International

Conference_Location

Austin, TX

Print_ISBN

0-7803-2996-1

Type

conf

DOI

10.1109/IEMT.1995.526178

Filename

526178