Title : 
A Robust Novel Technique for SPICE Simulation of ESD Snapback Characteristic
         
        
            Author : 
Jiao, Chao ; Yu, Zhiping
         
        
            Author_Institution : 
Inst. of Microelectron., Tsinghua Univ., Beijing
         
        
        
        
        
        
            Abstract : 
This paper presents a robust and novel technique for the circuit simulation of ESD (electrostatic discharge) snapback characteristic. A new linearization scheme for the avalanche current model in ESD evaluation shows a good convergence behavior during ESD stress simulation. This technique is compatible with the traditional circuit simulator based on the modified nodal analysis (MNA) like SPICE. We have implemented a simple ESD MOSFET model in SPICE3f5, and the simulation results are discussed
         
        
            Keywords : 
MOSFET; SPICE; circuit simulation; electrostatic discharge; linearisation techniques; ESD MOSFET model; ESD stress simulation; SPICE simulation; SPICE3f5; avalanche current model; circuit simulation; electrostatic discharge snapback characteristic; linearization scheme; modified nodal analysis; Circuit simulation; Convergence; Diodes; Electrostatic discharge; Feedback loop; MOSFET circuits; Resistors; Robustness; SPICE; Voltage;
         
        
        
        
            Conference_Titel : 
Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
         
        
            Conference_Location : 
Shanghai
         
        
            Print_ISBN : 
1-4244-0160-7
         
        
            Electronic_ISBN : 
1-4244-0161-5
         
        
        
            DOI : 
10.1109/ICSICT.2006.306185