DocumentCode :
3469754
Title :
Proactive control of engineering operations and lot loadings of product-mix and re-entrant in Q-time constraints processes
Author :
Toyoshima, Naoto ; Hasegawa, T. ; Ke Wu ; Arima, Sumika
Author_Institution :
Univ. of TsukubaTsukuba, Tsukuba, Japan
fYear :
2013
fDate :
6-6 Sept. 2013
Firstpage :
1
Lastpage :
4
Abstract :
This paper presented solutions respond to three issues of scheduling of semiconductor manufacturing. As the first we introduced a computer software with optimal logic and UI chart. We are ready to evaluate the performance in an actual Fab. In the second, optimal scheduling of fab operations and re-scheduling algorithm are discussed. Dynamic-CKB rule can reduce 931 rework lots during 6 days and 8782 hours in total waiting time compared with No-CKB. As the third, scheduling of product-mix and reentrant-mix lots is discussed for the throughput maximization and the cycle time minimization. OPC-REFS rule can solve the multipurpose problem for the throughput maximization and the cycle time minimization though general multi-purpose problem cannot be solve the problem in optimal. OPC-REFS rule which we proposed achieves the best performance regardless differences of recipes and production volumes among product-mix or flows.
Keywords :
production engineering computing; scheduling; semiconductor industry; Q-time constraints processes; UI chart; computer software; cycle time minimization; dynamic-CKB rule; engineering operations proactive control; fab operations; lot loadings; optimal logic; optimal scheduling; product-mix scheduling; re-scheduling algorithm; reentrant-mix lots; semiconductor manufacturing scheduling; throughput maximization; Computers; Facsimile; Furnaces; Loading; Maintenance engineering; Minimization; Preventive maintenance; Q-time constraints; Scheduling; Setup reduction; product-mix and re-entrant flows;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
e-Manufacturing & Design Collaboration Symposium (eMDC), 2013
Conference_Location :
Hsinchu
Type :
conf
DOI :
10.1109/eMDC.2013.6756046
Filename :
6756046
Link To Document :
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