Interconnect delay optimization using a novel hybrid insertion strategy

Interconnection techniques play an important role in the growth of semiconductor industry into future generations. A novel hybrid insertion strategy based on repeaters and low-swing differential-signaling circuits for global interconnect is presented in this paper. It takes advantage of those circuits on driving long wires in different length, and optimally inserts them along the wires. Simulation results using HSPICE for 0.18mum process show that delay, energy, energy-delay-product (EDP) and area are considerably decreased compared with other strategies available. Moreover, it is very suitable for integration in an EDA tool flow and helpful to the reuse of low-swing differential-signaling circuits