Title :
Study of Fab tool waste drain separation and reduction application in Bump process
Author :
Liu, K.C. ; Chang, C.N. ; Chen, W.M. ; Lan, J.K. ; Lien, Tony ; Lu, Jun ; Wei-Jen Huang ; Tseng, E. ; Tu, C.J. ; Lai, L.
Author_Institution :
Taiwan Semicond. Manuf. Co., Ltd., Hsinchu, Taiwan
Abstract :
All chemical reduction were achieved by Background study of chemicals used and discharged behavior in Fab tools, Waste drain concentration analysis, Fab tools adjustment of the PM procedure, Cu free etching chemical replacement, Theoretical waste vs. Actual waste, Waste separation based on recycling criteria to meet the maximum benefit, Total 75% waste chemical to be reduced effectively.
Keywords :
etching; recycling; semiconductor industry; separation; waste disposal; Fab tool waste drain reduction; Fab tool waste drain separation; bump process; chemical reduction; copper free etching chemical replacement; recycling criteria; semiconductor industry; tools adjustment; waste chemical; waste drain concentration analysis; waste separation; Chemicals; Hafnium; Joints; Lead; Maintenance engineering; Nickel; Recycling; Bump process; Reduction; Waste drain; separation;
Conference_Titel :
e-Manufacturing & Design Collaboration Symposium (eMDC), 2013
Conference_Location :
Hsinchu
DOI :
10.1109/eMDC.2013.6756060
