Quasi-blind voltage contrast in e beam inspection

Author

Hsiang-Chou Liao ; Hsiao-Leng Li ; Tuung Luoh ; Ling-Wu Yang ; Tahone Yang ; Kuang-Chao Chen ; Chih-Yuan Lu

Author_Institution

Technol. Dev. Center, Macronix Int. Co. Ltd., Hsinchu, Taiwan

fYear

2013

fDate

6-6 Sept. 2013

Firstpage

1

Lastpage

3

Abstract

The different inspection methodologies in e beam are put together to compare their inspection performance on irregularly periphery via plugs. The results demonstrate hot spot inspection mode has better alignment performance and higher sensitivity than leap and scan mode. Hot spot mode can inspect the tiny variation of voltage contrast (VC) with high sensitivities. One type of VC variation inspected by hot spot mode so call qausi-blind VC is addressed here that was not reported before.

Keywords

electric connectors; electron beam applications; flash memories; inspection; vias; Flash product; VC variation inspection; alignment performance; e beam inspection; hot spot inspection mode; inspection methodology; inspection performance; leap-scan mode; periphery via plugs; qausiblind VC; quasiblind voltage contrast; sensitivity; Facsimile; Image resolution; Optical imaging; Optical sensors; Signal resolution; Stimulated emission; Hot Spot; Leap and Scan; Surface Charging; Voltage Contrast; e Beam Inspection;

fLanguage

English

Publisher

ieee

Conference_Titel

e-Manufacturing & Design Collaboration Symposium (eMDC), 2013

Conference_Location

Hsinchu

Type

conf

DOI

10.1109/eMDC.2013.6756063

Filename

6756063