A novel structure to realize crack-free plastic package during reflow soldering process-development of CSS (chip side support) package

Author

Nakazawa, Tsutomu ; Unoue, Y. ; Sawada, Kanako ; Sudo, Toshio

Author_Institution

Semicond. Device Eng. Lab., Toshiba Corp., Kawasaki, Japan

fYear

1995

fDate

2-4 Oct 1995

Firstpage

310

Lastpage

317

Abstract

Reports a novel structure of a plastic package without a die-pad whereby adhesion strength is improved and thermal stress reduced. The non-die-pad structure has been realized by the chip side support (CSS) method. Furthermore, this paper describes the derivation of an equation that can be used as a criterion for judging package cracking or delamination by comparing the shear strength with the shear stress. The equation for shear stress can be estimated by the finite element method

Keywords

adhesion; delamination; finite element analysis; integrated circuit packaging; plastic packaging; reflow soldering; thermal stresses; adhesion strength; chip side support package; crack-free plastic package; delamination; finite element method; package cracking; reflow soldering process-development; shear strength; shear stress; thermal stress; Adhesives; Cascading style sheets; Delamination; Equations; Finite element methods; Lead; Moisture; Plastic packaging; Reflow soldering; Resins; Semiconductor device packaging; Thermal stresses; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International

Conference_Location

Austin, TX

Print_ISBN

0-7803-2996-1

Type

conf

DOI

10.1109/IEMT.1995.526180

Filename

526180