Title :
Inspection flow of yield impacting systematic defects
Author :
Chimin Chen ; ChengHua Yang ; Hsiang-Chou Liao ; Tuung Luoh ; Ling-Wu Yang ; Tahone Yang ; Kuang-Chao Chen ; Chih-Yuan Lu ; Donghua Liu ; Fan, Jintao ; Rong Lv
Author_Institution :
Technol. Dev. Center, Macronix Int. Co. Ltd., Hsinchu, Taiwan
Abstract :
Yield impacting systematic defects finding is no longer just relied on Design Rule Checking (DRC) provided by designer or Lithography Rule Checking (LRC) provided by post-optical proximity correction (OPC) results. An inspection flow is proposed in this paper, which is combining the inspection KLA tool and Hotspot Pattern Analyzer (HPA) database software to do the systematic defects filtering, sorting, grouping, and classification on the data base after hot scan inspection. 2nd time high sensitive inspection is done with new care area, which is reduced into one ten-thousandth of original inspection area. Following this inspection flow, we can identify the process window more accuracy.
Keywords :
inspection; lithography; materials handling; production engineering computing; semiconductor technology; HPA database software; KLA tool; design rule checking; hotspot pattern analyzer; inspection flow; lithography rule checking; post optical proximity correction; systematic defect classification; systematic defect filtering; systematic defect grouping; systematic defect sorting; Finite element analysis; Joints; Lead; Systematics; FEM; Hot Scan; PWQ; Pattern Grouping; Systematic Defect;
Conference_Titel :
e-Manufacturing & Design Collaboration Symposium (eMDC), 2013
Conference_Location :
Hsinchu
DOI :
10.1109/eMDC.2013.6756065
