DocumentCode :
3470090
Title :
A novel multiple resolution APC on CMP and Litho-Etching
Author :
Tsen, Andy ; Yen-Wei Cheng ; Yi-Ping Hsieh
Author_Institution :
Taiwan Semicond. Manuf. Co. Ltd., Hsinchu, Taiwan
fYear :
2013
fDate :
6-6 Sept. 2013
Firstpage :
1
Lastpage :
2
Abstract :
The present report relates generally to APC as applied to semiconductor fabrication and, more particularly, to system and method for implementing a multiple-resolution APC. We use two real cases in this report. The first one is a single stage CMP controller and the other one is a Litho-Etching CD inter-stages controller. The two cases both show excellent quality results and cost effective.
Keywords :
chemical mechanical polishing; etching; lithography; process control; CD inter-stages controller; CMP; litho-etching; multiple resolution APC; semiconductor fabrication; Analytical models; Facsimile; Force measurement; Process control; Semiconductor device modeling; Semiconductor device reliability; APC; CD; CMP; Etching; Litho; depth;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
e-Manufacturing & Design Collaboration Symposium (eMDC), 2013
Conference_Location :
Hsinchu
Type :
conf
DOI :
10.1109/eMDC.2013.6756066
Filename :
6756066
Link To Document :
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