• DocumentCode
    3470090
  • Title

    A novel multiple resolution APC on CMP and Litho-Etching

  • Author

    Tsen, Andy ; Yen-Wei Cheng ; Yi-Ping Hsieh

  • Author_Institution
    Taiwan Semicond. Manuf. Co. Ltd., Hsinchu, Taiwan
  • fYear
    2013
  • fDate
    6-6 Sept. 2013
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    The present report relates generally to APC as applied to semiconductor fabrication and, more particularly, to system and method for implementing a multiple-resolution APC. We use two real cases in this report. The first one is a single stage CMP controller and the other one is a Litho-Etching CD inter-stages controller. The two cases both show excellent quality results and cost effective.
  • Keywords
    chemical mechanical polishing; etching; lithography; process control; CD inter-stages controller; CMP; litho-etching; multiple resolution APC; semiconductor fabrication; Analytical models; Facsimile; Force measurement; Process control; Semiconductor device modeling; Semiconductor device reliability; APC; CD; CMP; Etching; Litho; depth;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    e-Manufacturing & Design Collaboration Symposium (eMDC), 2013
  • Conference_Location
    Hsinchu
  • Type

    conf

  • DOI
    10.1109/eMDC.2013.6756066
  • Filename
    6756066
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3470090