DocumentCode
3470094
Title
Plasma Etching Process Simulation for MEMS and IC Fabrication based on a Cellular Automata Method
Author
Zhou, Zai-Fa ; Huang, Qing-An ; Wei-Hua Li ; Zhu, Chi
Author_Institution
Key Lab. of MEMS, Southeast Univ., Nanjing
fYear
2006
fDate
Oct. 2006
Firstpage
1426
Lastpage
1428
Abstract
Mechanisms during plasma etching process in micro-electro-mechanical systems (MEMS) and integrated circuits (IC) fabrication have been analyzed. The plasma etching process has then been successfully simulated based on the plasma etching models and the cellular automata (CA) method for boundary movement simulation. Simulation results show an agreement with the available experimental results. This is useful for the research of plasma etching process and the development of MEMS and IC design
Keywords
cellular automata; integrated circuit design; micromachining; micromechanical devices; sputter etching; MEMS; cellular automata; integrated circuit fabrication; microelectromechanical systems; plasma etching; process simulation; Analytical models; Circuit simulation; Erbium; Fabrication; Micromechanical devices; Plasma applications; Plasma chemistry; Plasma simulation; Sputter etching; Sputtering;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
Conference_Location
Shanghai
Print_ISBN
1-4244-0160-7
Electronic_ISBN
1-4244-0161-5
Type
conf
DOI
10.1109/ICSICT.2006.306203
Filename
4098429
Link To Document