DocumentCode :
3470094
Title :
Plasma Etching Process Simulation for MEMS and IC Fabrication based on a Cellular Automata Method
Author :
Zhou, Zai-Fa ; Huang, Qing-An ; Wei-Hua Li ; Zhu, Chi
Author_Institution :
Key Lab. of MEMS, Southeast Univ., Nanjing
fYear :
2006
fDate :
Oct. 2006
Firstpage :
1426
Lastpage :
1428
Abstract :
Mechanisms during plasma etching process in micro-electro-mechanical systems (MEMS) and integrated circuits (IC) fabrication have been analyzed. The plasma etching process has then been successfully simulated based on the plasma etching models and the cellular automata (CA) method for boundary movement simulation. Simulation results show an agreement with the available experimental results. This is useful for the research of plasma etching process and the development of MEMS and IC design
Keywords :
cellular automata; integrated circuit design; micromachining; micromechanical devices; sputter etching; MEMS; cellular automata; integrated circuit fabrication; microelectromechanical systems; plasma etching; process simulation; Analytical models; Circuit simulation; Erbium; Fabrication; Micromechanical devices; Plasma applications; Plasma chemistry; Plasma simulation; Sputter etching; Sputtering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0160-7
Electronic_ISBN :
1-4244-0161-5
Type :
conf
DOI :
10.1109/ICSICT.2006.306203
Filename :
4098429
Link To Document :
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