Title :
Burn-in effectiveness-theory and measurement
Author :
Huston, Hance H. ; Wood, Michael H. ; DePalma, Vincent M.
Author_Institution :
IBM Gen. Technol. Div., East Fishkill, NY, USA
Abstract :
Burn-in effectiveness is modeled as a function of time, temperature, electrical stress, stress coverage and failure mechanism. Actual field data for a variety of products is used to validate or deduce the relevant burn-in parameters. The modeling of burn-in is discussed to show the importance of the acceleration and stress coverage of the burn-in and of the failure distribution of the product. The modeling of burn-in is used to explain the failure characteristics of products which experience burn-in. The modeling of the characteristics of the failure distribution of burned-in product was used to analyze several experimental or reliability data sets to either validate or deduce the relevant parameter estimates for the specific burn-in. The modeling also extracts the relevant burn-in parameters from an analysis of field reliability performance.<>
Keywords :
circuit reliability; failure analysis; integrated circuit manufacture; integrated circuit testing; production testing; quality control; IC; burn-in parameters; electrical stress; failure distribution; failure mechanism; field reliability performance; modeling; reliability data; semiconductor chips; stress coverage; temperature; Equations; Failure analysis; Hazards; Materials reliability; Semiconductor device manufacture; Semiconductor device measurement; Semiconductor device reliability; Semiconductor materials; Stress; Temperature;
Conference_Titel :
Reliability Physics Symposium, 1991, 29th Annual Proceedings., International
Conference_Location :
Las Vegas, NV, USA
Print_ISBN :
0-87942-680-2
DOI :
10.1109/RELPHY.1991.146027
