Title :
A Method of Thermal Analysis for CMOS Integrated Circuit
Author :
Sun, Jingying ; Feng, Shiwei ; Meng, Hao ; Zhang, Yuezong ; Liu, Jing ; Liu, Cheng
Author_Institution :
Sch. of Electron. Inf. & Control Eng., Beijing Univ. of Technol.
Abstract :
The paper presents a method for thermal analysis of integrated circuit, which combines a SPICE tool (HSPICE) with a finite element analysis tool (ANSYS). Since the connection between the two simulators is not so smooth, LinkCAD for ANSYS that provides seamless integration of the ANSYS products with the CAD environment is used in our work. By this method, thermal analysis of a general integrated circuit is accurately presented with the consideration of key sources of power dissipation and their temperature relation in CMOS IC
Keywords :
CAD; CMOS integrated circuits; SPICE; finite element analysis; integrated circuit modelling; thermal analysis; CMOS integrated circuits; HSPICE; LinkCAD; finite element analysis tool; thermal analysis; CMOS integrated circuits; CMOS technology; Circuit analysis; Circuit simulation; Energy consumption; Information analysis; Integrated circuit interconnections; Power dissipation; Temperature distribution; Thermal engineering;
Conference_Titel :
Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0160-7
Electronic_ISBN :
1-4244-0161-5
DOI :
10.1109/ICSICT.2006.306237
