A Method of Thermal Analysis for CMOS Integrated Circuit

Author

Sun, Jingying ; Feng, Shiwei ; Meng, Hao ; Zhang, Yuezong ; Liu, Jing ; Liu, Cheng

Author_Institution

Sch. of Electron. Inf. & Control Eng., Beijing Univ. of Technol.

fYear

2006

fDate

23-26 Oct. 2006

Firstpage

1462

Lastpage

1464

Abstract

The paper presents a method for thermal analysis of integrated circuit, which combines a SPICE tool (HSPICE) with a finite element analysis tool (ANSYS). Since the connection between the two simulators is not so smooth, LinkCAD for ANSYS that provides seamless integration of the ANSYS products with the CAD environment is used in our work. By this method, thermal analysis of a general integrated circuit is accurately presented with the consideration of key sources of power dissipation and their temperature relation in CMOS IC

Keywords

CAD; CMOS integrated circuits; SPICE; finite element analysis; integrated circuit modelling; thermal analysis; CMOS integrated circuits; HSPICE; LinkCAD; finite element analysis tool; thermal analysis; CMOS integrated circuits; CMOS technology; Circuit analysis; Circuit simulation; Energy consumption; Information analysis; Integrated circuit interconnections; Power dissipation; Temperature distribution; Thermal engineering;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on

Conference_Location

Shanghai

Print_ISBN

1-4244-0160-7

Electronic_ISBN

1-4244-0161-5

Type

conf

DOI

10.1109/ICSICT.2006.306237

Filename

4098441