DocumentCode
3470350
Title
Cu balls and Cu-core balls for 3D packaging
Author
Kawasaki, Hiroshi ; Hattori, Toshihiro ; Roppongi, Takahiro ; Soma, Daiki ; Kawamata, Yuji
Author_Institution
Adv. Technol. Div., Isamu Sato/ Senju Metal Ind. Co., Ltd., Moka, Japan
fYear
2013
fDate
11-13 Nov. 2013
Firstpage
1
Lastpage
3
Abstract
The use of Cu balls and Cu-core balls is focused on 3D packaging technology to maintain a stable standoff height. However, these materials show unique soldering behaviors that are different from solder balls. In this paper, we examine how to utilize them.
Keywords
copper; integrated circuit packaging; soldering; three-dimensional integrated circuits; 3D packaging technology; Cu; Cu balls; Cu-core balls; soldering behaviors; standoff height; Heating; Oxidation; Position measurement; Soldering; Thickness measurement; Three-dimensional displays; Time measurement; Cu/ Cu-core balls; self-alignment; soldering;
fLanguage
English
Publisher
ieee
Conference_Titel
CPMT Symposium Japan (ICSJ), 2013 IEEE 3rd
Conference_Location
Kyoto
Print_ISBN
978-1-4799-2718-0
Type
conf
DOI
10.1109/ICSJ.2013.6756080
Filename
6756080
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