DocumentCode :
3470361
Title :
SWEAT structure design and test procedure criteria based upon TEARS characterization and spatial distribution of failures in iterated structures
Author :
Crowell, Clarence R. ; Shih, Chih-Ching ; Tyree, Vance C.
Author_Institution :
Univ. of Southern California, Los Angeles, CA, USA
fYear :
1991
fDate :
9-11 April 1991
Firstpage :
277
Lastpage :
286
Abstract :
The authors consider the prime issues that should be raised when one considers the design of a test system and the procedure to be involved in the test. An extended TEARS (Thermal Energy Accounts for the Resistance of the System) analysis yields end-to-end temperature profiles of an N-fold iterated SWEAT (Standard Wafer-level Electromigration Acceleration Test) structure. The results give guidelines for the choice of voltage probe locations and current injection line lengths and also permit relating measurements on SWEAT structures with different numbers of elemental units and different geometry. Asymmetries in the first and last units correlate with the observed spatial distribution of failures. Criteria for much more rapid convergence and more accurate control of sample stress are presented.<>
Keywords :
circuit reliability; electromigration; failure analysis; integrated circuit testing; metallisation; quality control; SWEAT structure design; TEARS characterization; current injection line lengths; electromigration acceleration test; failures; iterated structures; sample stress control; spatial distribution; temperature profiles; test procedure criteria; test system design; voltage probe locations; Current measurement; Electrical resistance measurement; Electromigration; Guidelines; Life estimation; Probes; System testing; Temperature; Thermal resistance; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1991, 29th Annual Proceedings., International
Conference_Location :
Las Vegas, NV, USA
Print_ISBN :
0-87942-680-2
Type :
conf
DOI :
10.1109/RELPHY.1991.146028
Filename :
146028
Link To Document :
بازگشت