The investigation of SAWs propagation in layered anisotropic media for mechanical properties measurement of porous low-k dielectrics

Author

Li, Zhi-Guo ; Yao, Su-ying ; Xiao, Xia ; Bai, Mao-Sen ; Zhang, Xin-Hui

Author_Institution

Sch. of Electron. & Inf. Eng., Tianjin Univ.

fYear

2006

fDate

23-26 Oct. 2006

Abstract

Porous low-k materials are required for the advanced 45nm node and beyond ULSI interconnect system. The deteriorative mechanical properties of the porous materials must be evaluated accurately. Surface acoustic wave (SAW) technique can measure the Young´s modulus of thin films accurately and nondestructively by analyzing the dispersive characters of SAW waves´ propagation. In this paper, the theoretical investigation of SAW waves propagating in the transversely isotropic porous low-k film/silicon substrate layered structure is expressed. Several numerical examples are gived. These computation results can be applied to the SAW experiments to determinant the anisotropic Young´s modulus of periodic porous low-k film

Keywords

ULSI; Young´s modulus; acoustic wave propagation; anisotropic media; low-k dielectric thin films; nanoelectronics; porous materials; surface acoustic waves; 45 nm; ULSI interconnect system; Young modulus; anisotropic media; mechanical properties measurement; porous low-k dielectrics; surface acoustic waves; thin films; Acoustic measurements; Acoustic propagation; Anisotropic magnetoresistance; Dielectric materials; Dielectric measurements; Dielectric thin films; Mechanical factors; Mechanical variables measurement; Sawing machines; Surface acoustic waves;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on

Conference_Location

Shanghai

Print_ISBN

1-4244-0160-7

Electronic_ISBN

1-4244-0160-7

Type

conf

DOI

10.1109/ICSICT.2006.306241

Filename

4098445