• DocumentCode
    3470420
  • Title

    High-speed transmission copper cable for 25Gbit/s/lane

  • Author

    Sugiyama, Takatoshi ; Nonen, Hideki ; Fukasaku, Izumi ; Ishikawa, Hiroshi ; Kumakura, Takashi

  • Author_Institution
    Cable Mater. Lab., Hitachi Metals, Ltd., Hitachi, Japan
  • fYear
    2013
  • fDate
    11-13 Nov. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The conventional copper cable has the intra-pair skew about 10ps/m, and it makes using the copper cable for the 25Gbit/s/lane difficult. For the purpose of reducing intra-pair skew, we analyzed the generation factor of the intra-pair skew about some cables. For this analysis, we converted the S-parameters of cables into the impulse responses and the step responses of each mode. As a result, in the conventional copper cable, it became clear that the intra-pair skew was caused by the propagation time difference between differential mode and common mode, and that the reduction of the intra-par skew is difficult structurally. On the other hand, the new structure cable, “OMNIBIT®”, which has one batch extruded insulator covering two wires, does not have the propagation time difference between differential mode and common mode. It was confirmed that the new structure was hardly to increase the intra-pair skew structurally. As a result of the trial manufacturing with the new structure cable, it was confirmed that the intra-pair skew was less than or equal to 6ps/m.
  • Keywords
    S-parameters; cables (electric); copper; optical computing; optical interconnections; OMNIBIT structure; S-parameters; differential transmisson; generation factor; high-speed transmission copper cable; impulse responses; intrapair skew; step responses; Cable shielding; Copper; Power cable insulation; Power cables; Scattering parameters; Wires; 25Gbit/s; S-parameter; differential transmission; high-speed copper cable; intra-pair skew; rise-time skew;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    CPMT Symposium Japan (ICSJ), 2013 IEEE 3rd
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-1-4799-2718-0
  • Type

    conf

  • DOI
    10.1109/ICSJ.2013.6756085
  • Filename
    6756085