DocumentCode :
3470420
Title :
High-speed transmission copper cable for 25Gbit/s/lane
Author :
Sugiyama, Takatoshi ; Nonen, Hideki ; Fukasaku, Izumi ; Ishikawa, Hiroshi ; Kumakura, Takashi
Author_Institution :
Cable Mater. Lab., Hitachi Metals, Ltd., Hitachi, Japan
fYear :
2013
fDate :
11-13 Nov. 2013
Firstpage :
1
Lastpage :
4
Abstract :
The conventional copper cable has the intra-pair skew about 10ps/m, and it makes using the copper cable for the 25Gbit/s/lane difficult. For the purpose of reducing intra-pair skew, we analyzed the generation factor of the intra-pair skew about some cables. For this analysis, we converted the S-parameters of cables into the impulse responses and the step responses of each mode. As a result, in the conventional copper cable, it became clear that the intra-pair skew was caused by the propagation time difference between differential mode and common mode, and that the reduction of the intra-par skew is difficult structurally. On the other hand, the new structure cable, “OMNIBIT®”, which has one batch extruded insulator covering two wires, does not have the propagation time difference between differential mode and common mode. It was confirmed that the new structure was hardly to increase the intra-pair skew structurally. As a result of the trial manufacturing with the new structure cable, it was confirmed that the intra-pair skew was less than or equal to 6ps/m.
Keywords :
S-parameters; cables (electric); copper; optical computing; optical interconnections; OMNIBIT structure; S-parameters; differential transmisson; generation factor; high-speed transmission copper cable; impulse responses; intrapair skew; step responses; Cable shielding; Copper; Power cable insulation; Power cables; Scattering parameters; Wires; 25Gbit/s; S-parameter; differential transmission; high-speed copper cable; intra-pair skew; rise-time skew;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
CPMT Symposium Japan (ICSJ), 2013 IEEE 3rd
Conference_Location :
Kyoto
Print_ISBN :
978-1-4799-2718-0
Type :
conf
DOI :
10.1109/ICSJ.2013.6756085
Filename :
6756085
Link To Document :
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