• DocumentCode
    3470454
  • Title

    A cost effective TO-CAN packaged 10 Gbps EML module employing inductance compensation technique

  • Author

    Shirao, M. ; Ohata, N. ; Uto, Kuniaki ; Aruga, H.

  • Author_Institution
    Inf. Technol. R&D Center, Mitsubishi Electr. Corp., Kamakura, Japan
  • fYear
    2013
  • fDate
    11-13 Nov. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    We successfully developed a cost-effective 1.55-μm 10 Gbps electro-absorption modulated laser (EML) in a transistor outline (TO)-CAN package employing an inductance compensation technique. A TO-CAN packaged EML demonstrated a good optical eye opening with a mask margin of 27%.
  • Keywords
    electro-optical modulation; electroabsorption; electronics packaging; optical communication equipment; semiconductor lasers; TO-CAN packaged EML module; bit rate 10 Gbit/s; electro-absorption modulated laser; inductance compensation technique; size 1.55 mum; transistor outline-CAN package; Bandwidth; Coplanar waveguides; Impedance; Inductance; Optical filters; Reflection; Substrates; 10 Gbps; CAN; SFP+; TO-CAN; XFP;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    CPMT Symposium Japan (ICSJ), 2013 IEEE 3rd
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-1-4799-2718-0
  • Type

    conf

  • DOI
    10.1109/ICSJ.2013.6756087
  • Filename
    6756087