Title :
A Wafer-level pressure calibration method for integrated accelerometer and pressure sensor in TPMS application
Author :
Yangxi Zhang ; Fanrui Meng ; Guandong Liu ; Chengchen Gao ; Yilong Hao
Author_Institution :
Inst. of Microelectron., Peking Univ., Beijing, China
Abstract :
The tire pressure monitoring system (TPMS) normally contains an accelerometer. For piezoresistive accelerometers, low cost wafer-level full-range calibration is still a challenge. A novel wafer-lever pressure calibration method for accelerometer is reported in this paper. This method can be applied on a beam-block-membrane structure accelerometer which is sensitive to both acceleration and pressure. By measuring accelerometer´s full-range response in a static pressure test step, the method can significantly reduce testing cost and workload in TPMS sensor production. Integrated pressure sensor can also be tested in this pressure test step. Simulation results show the feasibility to calculate the accelerometer´s response from pressure test results. An integrated sensor (100g+500kPa measure range) for TPMS application was fabricated and measured through pressure test.
Keywords :
accelerometers; calibration; pressure sensors; wafer level packaging; Integrated pressure sensor; beam-block-membrane structure accelerometer; integrated accelerometer; tire pressure monitoring system; wafer-level pressure calibration method; Acceleration; Accelerometers; Calibration; Micromechanical devices; Piezoresistance; Pressure sensors; Sensitivity; Piezoresistive Accelerometer; Pressure Calibration; Tire Pressure Monitoring System; Wafer Level;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on
Conference_Location :
Anchorage, AK
DOI :
10.1109/TRANSDUCERS.2015.7181388