Title :
Thermal via technology for silica-based planar lightwave circuit
Author :
Aozasa, S. ; Kurata, Yu ; Hashizume, Yasuaki ; Itoh, M. ; Fukuyama, Hidenao
Author_Institution :
NTT Photonics Labs., NTT Corp., Atsugi, Japan
Abstract :
We propose the first thermal via technology for a silica-based planar lightwave circuit (PLC) to enable us to stack electronic components such as transimpedance amplifiers (TIAs) on a PLC. This is possible because the effective heat dissipation of the via can prevent the performance degradation of the TIA. The temperature increase of the TIAs was suppressed to only 8.7°C by the thermal vias, while it was 15.7°C without them. Silica-based PLCs with thermal vias will be a key technology for compact high performance PLC devices.
Keywords :
cooling; integrated optics; integrated optoelectronics; operational amplifiers; silicon compounds; PLC; SiO2; TIA; effective heat dissipation; silica-based planar lightwave circuit; stack electronic components; temperature 15.7 degC; temperature 8.7 degC; thermal via technology; transimpedance amplifiers; Conductivity; Glass; Heating; Microassembly; Optical devices; Silicon; Thermal conductivity; TIA; silica-based planar lightwave circuit; stack integration; thermal via;
Conference_Titel :
CPMT Symposium Japan (ICSJ), 2013 IEEE 3rd
Conference_Location :
Kyoto
Print_ISBN :
978-1-4799-2718-0
DOI :
10.1109/ICSJ.2013.6756092
